PCB廠商在生產RDL產品時的影像檢驗中，遇到了因使用透明基材(介電材)，導致線路層之間混淆，進而無法對當下製程做自動化檢驗的困擾。本篇的研究目的為開發一套濾除RDL產品中，因透明基材顯現出的下層線路干擾，並在上層線路與背景中呈現高對比度的影像擷取系統。 在經由一系列的測試後，本研究成功的透過RDL的結構中基材的螢光反應，開發了「應用螢光顯微技術強化RDL線路檢測系統」用來改善AOI在RDL線路檢測時失效的問題。在實驗中，利用基材螢光反應的特性，將原檢測系統基於影像中線路與背景色差產生的對比，替換成為影像中兩者間螢光表現差異，並搭配短波長光線於透明基材中快速衰減的特性，避免了線路層與層之間的混淆。在檢測的影像的改良上，上層線路與背景的對比度由原先的5 % ~ 10 %之間增加到了80 %以上，而主要造成干擾的前製程影像也由原本的47 %降低為20 %以下，大幅的降低了檢測上層線路提取的難度，使得RDL線路檢測化為可能。 本研究開發之螢光影像擷取系統，目前已可提供線路上最為重要的短路及斷路檢測，並透過實際的樣品測試證實其可行性。在部分特定的RDL線路檢測方面，本研究也根據螢光顯微鏡的研究以及建置經驗，提出了雙影像的影像擷取方法，此方法目前僅停留在設計階段，尚未完成架構及可行性驗證。 ;During the image inspection of RDL products, PCB manufacturers encountered the problem of confusion between circuit layers due to the use of transparent substrates (dielectric materials), which prevented automatic inspection of the current manufacturing process. The research purpose of this article is to develop an image capture system that filters out the interference of the lower layer circuit due to the transparent substrate in the RDL product, and presents a high contrast between the upper layer circuit and the background. After a series of tests, this study successfully developed the "enhanced RDL circuit inspection system using fluorescence microscopy technology" through the fluorescent reaction of the substrate in the RDL structure to improve the failure of AOI in RDL circuit inspection. question. In the experiment, using the characteristics of the fluorescent reaction of the substrate, the original detection system based on the contrast between the color difference between the circuit and the background in the image was replaced by the difference in fluorescence between the two in the image, and short-wavelength light was used in the transparent substrate. The characteristic of fast attenuation avoids confusion between circuit layers and layers. With regard to the improvement of the detected image, the contrast between the upper circuit and the background has increased from 5% to 10% to over 80%, and the pre-process image which mainly caused interference has also been reduced from 47% to less than 20%. It greatly reduces the difficulty of detecting upper-layer line extraction, making RDL line detection possible. The fluorescent image capture system developed in this research can provide the most important short circuit and open circuit detection on the line, and its feasibility has been confirmed through actual sample tests. In terms of some specific RDL circuit detection, this study also proposes a dual-image image capture method based on the research and construction experience of the fluorescent microscope. This method is currently only in the design stage, and has not yet completed the structure and feasibility verification.
