氧電漿表面處理對感光性介電材料與金屬薄膜界面附著力之影響

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題名:	氧電漿表面處理對感光性介電材料與金屬薄膜界面附著力之影響
作者:	張博凱;Po-Kai, Chang
貢獻者:	化學工程與材料工程學系
關鍵詞:	氧電漿;感光性介電材料;附著力;oxygen plasma;photosensitive dielectric;photo-imageable dielectric;adhesion
日期:	2023-08-14
上傳時間:	2024-09-19 14:49:13 (UTC+8)
出版者:	國立中央大學
摘要:	電漿表面改質技術已廣泛應用於高分子材料，表面改質可改變接觸角與官能基團，進而影響表面親疏水性質，也能使表面粗糙度產生變化。此外，也將使用不同於業界常用的PI感光性介電材料，改為使用新式的感光性介電材料來當作本研究附著力的材料。此種介電材料具較低的烘烤硬化溫度 (<200℃) 也有良好的顯影解析度，最重要的是能減少RDL生產成本。若能讓金屬導電層附著於其上不輕易發生剝離現象，便能進一步思考能否實際應用於產業界。實驗將藉由氧氣電漿蝕刻製程的氧離子轟擊打斷PID表面原子之間的化學鍵，藉此在材料表面形成特定的官能基團與帶有懸浮鍵之原子，並與金屬產生鍵結。首先分析氧氣電漿對感光性介電材料表面的化學組成與表面形貌產生何種改變，並且在表面處理後，以磁控射頻濺鍍法製備Ti/Cu金屬薄膜，觀察異質界面PID/Ti/Cu之接合情形；最後使用百格刀測試初步評估附著性，亦利用電鍍法增厚Cu層至20微米模擬實際應用之銅導線厚度，再次評估附著性。從結果得知，氧氣電漿能提高表面含氧基團的比例也能提升表面粗糙度，濺鍍薄膜具良好的附著性，卻因微結構不同而在電鍍後附著力有顯著差異，可見鍍膜製程對薄膜附著力之影響。總而言之，本實驗導入新式感光性介電材料並使用氧電漿進行表面處理，利用材料分析方法找出影響附著力的因素，為往後異質界面的接合技術提供一個改善附著力的標準作業流程。;Plasma surface modification techniques have been widely used for polymer materials. Surface modification can alter contact angles and functional groups, thereby affecting surface hydrophilicity or hydrophobicity. It can also lead to changes in surface roughness. Furthermore, this study intends to replace the commonly used photo-imageable dielectric material, PI, with a new type of photo-imageable dielectric (PID) material for adhesion testing purposes. This PID has a lower curing temperature (<200℃) and excellent development resolution, which significantly reduce redistribution layers (RDL) production costs. If a strong adhesion behavior between the metal layer and the dielectric material layer can be achieved, potential industrial applications can be explored. The experiment involves O2 plasma etching, which breaks chemical bonds between atoms on the surface of the PID. This process creates specific functional groups and dangling bonds on the surface of polymer, interacting with metals. On the first step, the changes in chemical composition and surface morphology of the PID after O2 plasma treatment was analyzed using XPS. After surface modification, Ti/Cu thin films were deposited using magnetron sputtering, and the microstructure at the interface of PID/Ti/Cu was observed by SEM. Adhesion property was preliminarily assessed using a cross-cut test, and then cross-cut test was conducted again to re-evaluate the electroplated Cu foil with a thickness of 20 μm. As a result of this study, oxygen plasma treatment increases the proportion of oxygen-containing functional groups on the surface and enhances surface roughness. In addition, the sputter-deposited film exhibits good adhesion; however, significant differences in adhesion after electroplating were observed due to some difference observed in microstructure. This highlights the influence of the thin-film deposition process. In conclusion, this study introduces a novel PID and employs oxygen plasma surface treatment. It utilizes material analysis methods to identify factors influencing adhesion, establishing a standard operation procedure to material characterization for future of hybrid bonding technology for heterogeneous integration.
顯示於類別:	[化學工程與材料工程研究所] 博碩士論文

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