在製程變動的情況，晶片的良率會因為在晶圓上不同的位置下，會有不同的特徵。這些因製程而導致良率變化的特色，從晶圓圖的觀點來觀察是最容易了解的。在這篇論文中，我們從收集到的資料中歸納出晶圓圖會有以蝠翼良率的變化特色，然後將這變化的特色加入了空間相關性，最後提出一個具有空間相關性晶圓圖產生器並且是可以產生群聚的現象，同時也建構出一個快速分析群聚現象位置和大小的方法。 Under the process variation, the yield of the chips which are at the different locations with different characterization is in the same wafer. Because of the characterization of the yield of the process variation, it is the easiest observation from the viewpoint of the wafer-map. In this paper, we suggest a wafer map generator with the special correlation which is based on the characterization of the bat-wing yield. The wafer map generator can produce the cluster phenomenon, and the rapid method has been established to judge the position and size of the cluster.
