In-situ observation of material migration in flip-chip solder joints under current stressing

NCUIR > Engineering College > National Central University Department of Chemical & Materials Engineering > journal & Dissertation > Item 987654321/30420

Please use this identifier to cite or link to this item: http://ir.lib.ncu.edu.tw/handle/987654321/30420

Title:	In-situ observation of material migration in flip-chip solder joints under current stressing
Authors:	Tsai,C. M.;Lai,Yi-Shao;Lin,Y. L.;Chang,C. W.;Kao,C. R.
Contributors:	化學工程與材料工程研究所
Keywords:	ELECTROMIGRATION FAILURE;DISSOLUTION;TIN
Date:	2006
Issue Date:	2010-07-06 16:19:02 (UTC+8)
Publisher:	中央大學
Abstract:	This investigation studies how electron flow distribution and the vacancy concentration gradient affect the diffusion of solder atoms in a flip-chip solder joint under current stress. The migration of materials was traced by monitoring the positions of 21
Relation:	JOURNAL OF ELECTRONIC MATERIALS
Appears in Collections:	[National Central University Department of Chemical & Materials Engineering] journal & Dissertation

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