DITM模型上不同測試方法和測試流程的良率分析;Yield Analysis of Different Test Method and Test Flow on DITM Model

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Title:	DITM模型上不同測試方法和測試流程的良率分析;Yield Analysis of Different Test Method and Test Flow on DITM Model
Authors:	張家睿;Chang, Jia-Ruei
Contributors:	電機工程學系
Keywords:	重複測試;重測;自動測試防護帶規劃;repeat test;retest;auto guardband
Date:	2022-08-01
Issue Date:	2022-10-04 12:05:01 (UTC+8)
Publisher:	國立中央大學
Abstract:	本論文以DITM(digital integrated-circuit testing model)測試模型為基礎，並以自動規劃測試防護帶的測試系統(auto-guardbanding)為輔助，在假設相同的缺陷程度(Defect Level)的前提下，比較不同重複測試方案和不同測試流程對測試良率的影響。首先，使用一種以統計概念開發的DITM測試模型，並以測試良率與測試品質做為測試結果的評斷標準。此模型以常態分佈為基礎，納入多項表達製造能力與測試能力的參數，並輔以測試防護帶與重複測試的概念，衍伸出一套嶄新的測試機制。接著，透過簡化重複測試公式，以及比較測試規格(TS)-測試品質(Test Quality)圖的關係，決定使用二分法(bisection method)來實現自動規劃測試防護帶的測試系統(auto-guardbanding)，其能在固定測試品質與次數的條件下，迅速得出適當的測試規格。最終透過上述的測試模型以及測試系統的輔助，先比較不同的重複測試方案，再比較不同的重測(retest)測試流程對測試良率的影響。 ;This paper is based on the DITM test model, and is assisted by an auto-guardbanding test system. Under the premise of assuming the same Defect Level, compare the impact of different repeat test schemes and different testing processes on the test yield. First, a DITM test model developed with statistical concepts is used, and the test yield and test quality are used as the evaluation criteria for test results. This model is based on the normal distribution, incorporates a number of parameters that express the manufacturing capability and testing capability, and is supplemented by the concepts of testing guard bands and repeated testing, and a new testing mechanism is derived. Then, by simplifying the repeat test formula and comparing the relationship between the test specification and the test quality diagram, it is decided to use the bisection method to realize the auto-guardbanding test system that automatically plans the test guardband. It can quickly obtain appropriate test specifications under the condition of fixed test quality and frequency. Finally, with the aid of the above-mentioned test model and test system, firstly compare different repeat test schemes, and then compare the impact of different retest test procedures on the test yield.
Appears in Collections:	[Graduate Institute of Electrical Engineering] Electronic Thesis & Dissertation

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