使用上照式面投影微光固化技術開發具有液面拘束器之軟性基板製造系統;Development of Flexible Substrate Fabrication System with Constraint Surface Device by Top-down Projection Micro Stereolithography Technology

NCUIR > Engineering College > Graduate Institute of Mechanical Engineering > Electronic Thesis & Dissertation > Item 987654321/93892

Please use this identifier to cite or link to this item: http://ir.lib.ncu.edu.tw/handle/987654321/93892

Title:	使用上照式面投影微光固化技術開發具有液面拘束器之軟性基板製造系統;Development of Flexible Substrate Fabrication System with Constraint Surface Device by Top-down Projection Micro Stereolithography Technology
Authors:	許子謙;Xu, Zi-Qian
Contributors:	機械工程學系
Keywords:	積層製造;微光固化;液面拘束器;軟性基板;Additive manufacturing;Micro-stereolithography;Constraint surface device;Flexible substrate
Date:	2024-01-19
Issue Date:	2024-09-19 17:45:29 (UTC+8)
Publisher:	國立中央大學
Abstract:	軟性印刷電路板(Flexible Printed Circuit Board, FPCB)不同於一般的印刷電路板(Printed Circuit Board, PCB)，因為其重量輕、厚度薄、可彎曲等特性，常用來作為承載電子元件並進行通訊的平台。投影微立體光固化技術(Projection Micro Stereolithography, PμSL)為一種低成本且高效率的技術，能夠列印出具有微米級的複雜三維結構。透過其層層堆疊成型的特性，製造者可以在電路基板內部設計更複雜的電路，達到更加客製化的目的，並且能夠選擇更加具有撓曲性的材料，供使用者在操作的過程中能夠更加靈活。本研究致力於使用積層製造方法列印軟性基板，為了達成這個目的設計了一套上照式光固化系統，並且開發了以 C#作為編譯語言之人機介面方面後續使用者操作。在光學照明系統方面，選用了內建數位微鏡裝置(Digital Micromirror Device, DMD)之數位光處理(Digital Light Process, DLP)光機作為投影光源，並且在出光處加裝了具有微縮化光源之光路將投影光源微縮至我們所想要的面積。為了控制列印成品的層厚，本研究特別設計了液面拘束器，搭配工作平台的升降來控制液面高度。為了避免列印過程中因為工作平台傾斜或投影像平面失焦，造成列印成品失真的情況，本研究亦另外設計了工作平台水平校正流程以及 DLP 光機自動對焦流程來改善這個情況。最後本研究以矽膠樹脂作為列印材料，透過觀察樹脂在不同曝光情況下的列印結果來制定相應的曝光參數。最後透過這些曝光參數成功列印分別為多孔特徵以及具有 LED線路之軟性基板列印結果，驗證了列印系統的可行性。;Flexible Printed Circuit Board (FPCB) is different from ordinary Printed Circuit Board (PCB) because of its light weight, thin thickness, bendability and other characteristics. It is often used to carry electronic components and communicate. platform. Projection Micro Stereolithography (PμSL) is a low-cost and high-efficiency technology that can print complex three-dimensional structures at the micron level. Through its layer-by-layer stacking characteristics, manufacturers can design more complex circuits inside the circuit substrate to achieve more customized purposes, and more flexible materials can be selected so that users can be more flexible during operation. This research is dedicated to printing flexible substrates using the Additive Manufacturing method. To achieve this goal, a top-illumination light curing system was designed, and subsequent user operations in human-machine interface using C# as the compiled language were developed. In terms of the optical lighting system, a Digital Light Process(DLP) light engine with a built-in Digital Micromirror Device(DMD) chip was selected as the projection light source, and a light path with a miniaturized light source was installed at the light outlet to shrink the projection light source to the area we want. In order to control the layer thickness of the printed product, this study specially designed a liquid level restrainer, which is used to control the liquid level height in conjunction with the lifting of the work platform. In order to avoid distortion of the printed product due to the tilt of the work platform or the out-of-focus projection image plane during the printing process, this study also designed a work platform level correction process and a DLP light engine autofocus process to improve this situation. Finally, this study uses silicone resin as the printing material, and determines the corresponding exposure parameters by observing the printing results of the resin under different exposure conditions. Finally, the printing results of porous features and flexible substrates with LED circuits were successfully printed using these exposure parameters, which verified the feasibility of the printing system.
Appears in Collections:	[Graduate Institute of Mechanical Engineering] Electronic Thesis & Dissertation

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