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    Items for Author "李天錫" 

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    Showing 13 items.

    Collection Date Title Authors Bitstream
    [材料科學與工程研究所 ] 研究計畫 2009-09-01 常壓電漿智切法在矽基上合成單晶磷化銦材料;Integration of Atmospheric Pressure Plasma with Smart Cut Process to Fabricate Single Crystal InP on Silicon Materials 李天錫
    [機械工程學系] 研究計畫 2024-09-27 形成暫時性異質接面在半導體基板正表面以強化其背面電化學反應之研究;Research on Forming Temporary Heterogeneous Interfaces on the Front-Side Surface of Semiconductor Substrates to Enhance Electrochemical Processes on the Back-Side Surface 李天錫
    [機械工程學系] 研究計畫 2024-01-26 科研創業計畫:SiC第三類半導體晶圓材料快速薄化 李天錫
    [機械工程學系] 研究計畫 2023-07-17 在重摻雜N型半導體或高純度矽晶材料中轉換介面壁壘型態使電洞流為主控電流,以進行表面陽極氧化合成奈米結構;Transforming the Type of Interface Barrier to Make Hole Current as of the Dominant Current in Heavily Doped N-Type Semiconductors or in High-Purity Silicon Anodizes Its Surface for Synthesizing Nano-Structure 李天錫
    [機械工程學系] 研究計畫 2023-03-08 科研創業計畫:SiC第三類半導體晶圓材料快速薄化 李天錫
    [機械工程學系] 研究計畫 2021-12-21 在重摻雜N型半導體或高純度矽晶材料中轉換介面壁壘型態使電洞流為主控電流,以進行表面陽極氧化合成奈米結構;Transforming the Type of Interface Barrier to Make Hole Current as of the Dominant Current in Heavily Doped N-Type Semiconductors or in High-Purity Silicon Anodizes Its Surface for Synthesizing Nano-Structure 李天錫
    [機械工程學系] 研究計畫 2021-12-21 整合電化學及微波化學原理開發綠色高性能薄化與拋光製程;Integrating Electrochemical and Microwave Chemical Principles to Develop Green High-Performance Thinning and Polishing Processing 李天錫
    [機械工程學系] 研究計畫 2020-01-13 研究由蕭特基勢壘在電化學中的電荷積累效應以開發出無光源陽極化N型矽技術;Research on Charge-Accumulation Effect of Schottky Barrier on Electrochemistry to Develop the Technology of Anodizing N-Type Silicon in the Dark 李天錫
    [機械工程學系] 研究計畫 2018-12-19 深冷電化學在矽基板上合成奈米晶之研究;A Study on Cryo-Electrochemistry to Fabricate Nanocrystals on Si Substrate 李天錫
    [機械工程學系] 研究計畫 2017-08-01 低溫光電化學直接在矽基板上合成奈米晶之研究;A Study on Low Temperature Photoelectrochemistry to Directly Fabricate Nanocrystals on Si Wafer 李天錫
    [機械工程學系] 研究計畫 2016-08-31 以對稱鍵合結構抵銷熱應力實現異質材料晶圓鍵合及薄膜轉移之研究(II);Study for Symmetrical Bonded Structure Canceling Thermal Stresses to Realize Wafer Bonding and Layer Transfer of Dissimilar Materials (Continuing for the Second Year Study) 李天錫
    [機械工程學系] 研究計畫 2016-03-29 以對稱鍵合結構抵銷熱應力實現異質材料晶圓鍵合及薄膜轉移之研究;Study for Symmetrical Bonded Structure Canceling Thermal Stresses to Realize Wafer Bonding and Layer Transfer of Dissimilar Materials 李天錫
    [機械工程學系] 研究計畫 2008-09-01 多孔矽為應力源製作絕緣層應變矽材料製作之研究;Study on Fabrication of Strained-Si on Insulator Materils by Porous Silicon 李天錫

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