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    NCU Institutional Repository > 理學院 > 化學學系 > 期刊論文 >  Item 987654321/100385


    請使用永久網址來引用或連結此文件: https://ir.lib.ncu.edu.tw/handle/987654321/100385


    題名: Adsorption and desorption of bis-(3-sulfopropyl) disulfide during cu electrodeposition and stripping at Au electrodes
    作者: 姚學麟;Chiu, Yong-Da;Dow, Wei-Ping;Krug, Klaus;Liu, Yung-Fang;Lee, Yuh-Lang;Yau, Shueh-Lin
    貢獻者: 理學院化學學系
    關鍵詞: adsorption;Chemistry;chlorides;copper;desorption;Electrochemistry;electrodes;Exact sciences and technology;General and physical chemistry;gold;ions;oxidation;reaction mechanisms;scanning electron microscopy;Surface physical chemistry;X-ray photoelectron spectroscopy
    日期: 2012-10-09
    上傳時間: 2026-04-21 14:00:01 (UTC+8)
    出版者: American Chemical Society;Washington, DC: American Chemical Society
    摘要: 摘要: The adsorption and desorption of bis-(3-sulfopropyl) disulfide (SPS) on Cu and Au electrodes and its electrochemical effect on Cu deposition and dissolution were examined using cyclic voltammetry stripping (CVS), field-emission scanning electron microscopy (FESEM), and X-ray photoelectron spectroscopy (XPS). SPS dissociates into 3-mercapto-1-propanesulfonate when it is contacted with Au and Cu electrodes, producing Cu(I)- and Au(I)-thiolate species. These thiolates couple with chloride ions and promote not only the reduction of Cu2+ in Cu deposition but also the oxidation of Cu0 to Cu+ in Cu stripping. During Cu electrodeposition on the SPS-modified Au electrode, thiolates transfer from Au onto the Cu underpotential deposition (UPD) layer. The Cu UPD layer stabilizes a large part of the transferred thiolates which subsequently is buried by the Cu overpotential deposition (OPD) layer. The buried thiolates reappear on the Au electrode after the copper deposit is electrochemically stripped off. A much smaller part of thiolates transfers to the top of the Cu OPD layer. In contrast, when SPS preadsorbs on a Cu-coated Au electrode, almost all of the adsorbed SPS leaves the Cu surface during Cu electrochemical stripping and does not return to the uncovered Au surface. A reaction mechanism is proposed to explain these results.
    其他題名: Langmuir
    出版者: Washington, DC: American Chemical Society
    出版日期: 2012-10-09
    出處: Langmuir, 2012-10, Vol.28 (40), p.14476-14487
    資源來源: American Chemical Society Journals
    版權: Copyright © 2012 American Chemical Society
    版權: 2015 INIST-CNRS
    識別號: ISSN: 0743-7463
    識別號: ISSN: 1520-5827
    識別號: EISSN: 1520-5827
    識別號: DOI: 10.1021/la3025183
    識別號: PMID: 22978781
    識別號: CODEN: LANGD5
    顯示於類別:[化學學系] 期刊論文

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