A study of large area die bonding materials and their corresponding mechanical and thermal properties

Please use this identifier to cite or link to this item: https://ir.lib.ncu.edu.tw/handle/987654321/103023

Title:	A study of large area die bonding materials and their corresponding mechanical and thermal properties
Authors:	孫慶成;Chung, Te-yuan;Jhang, Jian-Hong;Chen, Jing-Sian;Lo, Yi-Chien;Ho, Gwo-Herng;Wu, Mount-Learn;Sun, Ching-Cherng
Contributors:	理學院光電科學與工程學系
Keywords:	Bonding;Gold;Heat transfer;Pastes;Silver;Solders;Thermal resistance
Date:	2012-05-01
Issue Date:	2026-04-23 11:21:59 (UTC+8)
Publisher:	Elsevier Ltd.;Elsevier Ltd
Abstract:	摘要： We tested the ability of Au/Sn eutectic, silver paste, and solder paste to bond to a large area as well as the bonding of a high power LED die to a highly conductive submount. The samples ran through several tests including ultrasound image, shear force, and thermal resistance measurement. Finite element analysis (FEA) models were built for comparison and analysis. Au/Sn bonding shows the best thermal and mechanical properties. Silver paste shows lower contact thermal resistance compared with solder paste. Although the thickness of the silver paste bonding layer is greater than the solder paste bonding layer, the average total thermal resistance is noticeably lower than the solder paste bonded samples. 出版者： Elsevier Ltd 出版日期： 2012-05 出處： Microelectronics and reliability, 2012-05, Vol.52 (5), p.872-877 資源來源： Elsevier ScienceDirect Journals Complete 版權： 2011 Elsevier Ltd 識別號： ISSN: 0026-2714 識別號： DOI: 10.1016/j.microrel.2011.03.029
Appears in Collections:	[Department of Optics and Photonics] journal & Dissertation

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