A study of large area die bonding materials and their corresponding mechanical and thermal properties

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题名:	A study of large area die bonding materials and their corresponding mechanical and thermal properties
作者:	孫慶成;Chung, Te-yuan;Jhang, Jian-Hong;Chen, Jing-Sian;Lo, Yi-Chien;Ho, Gwo-Herng;Wu, Mount-Learn;Sun, Ching-Cherng
贡献者:	理學院光電科學與工程學系
关键词:	Bonding;Gold;Heat transfer;Pastes;Silver;Solders;Thermal resistance
日期:	2012-05-01
上传时间:	2026-04-23 11:21:59 (UTC+8)
出版者:	Elsevier Ltd.;Elsevier Ltd
摘要:	摘要： We tested the ability of Au/Sn eutectic, silver paste, and solder paste to bond to a large area as well as the bonding of a high power LED die to a highly conductive submount. The samples ran through several tests including ultrasound image, shear force, and thermal resistance measurement. Finite element analysis (FEA) models were built for comparison and analysis. Au/Sn bonding shows the best thermal and mechanical properties. Silver paste shows lower contact thermal resistance compared with solder paste. Although the thickness of the silver paste bonding layer is greater than the solder paste bonding layer, the average total thermal resistance is noticeably lower than the solder paste bonded samples. 出版者： Elsevier Ltd 出版日期： 2012-05 出處： Microelectronics and reliability, 2012-05, Vol.52 (5), p.872-877 資源來源： Elsevier ScienceDirect Journals Complete 版權： 2011 Elsevier Ltd 識別號： ISSN: 0026-2714 識別號： DOI: 10.1016/j.microrel.2011.03.029
显示于类别:	[光電科學與工程學系] 期刊論文

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