Institute of Electrical and Electronics Engineers Inc.;IEEE
摘要:
摘要： The chip-level 1 × 2 optical interconnects using the polymer vertical splitter developed on a silicon substrate are demonstrated. The 1 × 2 vertical-splitting configuration is realized using a polymer waveguide terminated at three silicon 45 ° reflectors. The high-frequency transmission lines combined with the indium solder bumps are developed to flip-chip assemble a vertical-cavity surface-emitting laser chip at the input port and two photodetector chips at two output ports. Total transmission loss of -3.26 dB with a splitting ratio of 1 : 1 for the proposed splitter is experimentally obtained. A 10-Gbit/s data transmission with bit error rates better than 10 -12 for two output ports is achieved. It reveals that such chip-level 1 × 2 optical interconnects using the polymer vertical splitter are suitable for high-speed data transmission with multiple output ports. 其他題名： JPHOT 出版者： IEEE 出版日期： 2014-04 出處： IEEE photonics journal, 2014-04, Vol.6 (2), p.1-10 資源來源： IEEE Electronic Library (IEL) 識別號： ISSN: 1943-0655 識別號： ISSN: 1943-0647 識別號： EISSN: 1943-0647 識別號： DOI: 10.1109/JPHOT.2014.2306843 識別號： CODEN: PJHOC3
