SPIE;Society of Photo-Optical Instrumentation Engineers
摘要:
摘要： The development of a 4-channel×10-Gbits/s optical interconnect module based on a silicon optical bench (SiOB) is presented. The 4-channel vertical-cavity surface-emitting laser (VCSEL) and photo diode (PD) arrays are flip-chip assembled onto the pedestals of SiOB using Au/Sn solder bumps to form an SiOB-based bi-directional optical sub-assembly (BOSA) configuration. The optical coupling of VCSEL-to-multi-mode fiber (MMF) and MMF-to-PD without adding coupled optics is −5.2 and −2 dB, respectively. The wide alignment tolerances of 1-dB power variation for the transmitting and receiver parts to be ±15 μm are achieved. The clearly open 10-Gbits/s eye patterns of transmitting part as well as the 10−12-order bit error rate (BER) at the receiving part verify the proposed SiOB-based module is suitable for the application of 4-channel×10-Gbits/s optical interconnects. 其他題名： Opt. Eng 出版者： Society of Photo-Optical Instrumentation Engineers 出版日期： 2012-11-01 出處： Optical engineering, 2012-11, Vol.51 (11), p.115005-115005 版權： 2012 Society of Photo-Optical Instrumentation Engineers (SPIE) 識別號： ISSN: 0091-3286 識別號： EISSN: 1560-2303 識別號： DOI: 10.1117/1.OE.51.11.115005
