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    Please use this identifier to cite or link to this item: https://ir.lib.ncu.edu.tw/handle/987654321/107858


    Title: N2O treatment enhancement-mode InAlN/GaN HEMTs with HfZrO2 High-k insulator
    Authors: 綦振瀛;Chiu, Hsien-Chin;Wu, Chia-Hsuan;Chi, Ji-Fan;Chyi, J-I;Lee, G-Y
    Contributors: 資訊電機學院電機工程學系
    Keywords: Channels;Devices;Electrodes;Fluctuation;Gallium nitrides;Gates;Insulators;Nitrous oxides;Noise
    Date: 2015-01-01
    Issue Date: 2026-04-23 14:27:29 (UTC+8)
    Publisher: Elsevier Ltd.
    Abstract: 摘要: A normally-off InAlN/GaN MIS-HEMT with HfZrO sub(2) gate insulator was realized and investigated. By using N sub(2)O plasma treatment beneath the gate region, 13 nm InAlN Schottky layer was oxidized to AlON sub(x) + 4 nm InAlN Schottky layer. The strong polarization induced carriers in traditional InAlN/GaN 2 DEG quantum well was reduced for enhancement-mode operation. High-k thin film HfZrO sub(2) was used for gate insulator of E-mode device to further suppress gate leakage current and enhance device gate operation range. The maximum drain current of E-mode InAlN/GaN MIS-HEMT was 498 mA/mm and this value was higher than previous published InAlN/GaN E-mode devices. The measurement results of low-frequency noise also concluded that the low frequency noise is attributed to the mobility fluctuation of the channel and N sub(2)O plasma treatment did not increase fluctuation center of gate electrode.
    出版日期: 2015-01-01
    出處: Microelectronics and reliability, 2015-01, Vol.55 (1), p.48-51
    資源來源: ScienceDirect (Elsevier) Journals
    識別號: ISSN: 0026-2714
    識別號: DOI: 10.1016/j.microrel.2014.09.026
    Appears in Collections:[Department of Electrical Engineering] journal & Dissertation

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