Study of wetting reaction between eutectic AuSn and Au foil

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Please use this identifier to cite or link to this item: http://ir.lib.ncu.edu.tw/handle/987654321/29858

Title:	Study of wetting reaction between eutectic AuSn and Au foil
Authors:	Lai YT,Liu CY
Contributors:	材料科學與工程研究所
Date:	2006
Issue Date:	2010-07-06 15:59:30 (UTC+8)
Publisher:	中央大學
Abstract:	Wetting reactions between eutectic AuSn solder and Au foil have been studied. During the reflow process, Au foil dissolution occurred at the interface of AuSu, which increases with temperature and time. The activation energy for Au dissolution in molte
Relation:	JOURNAL OF ELECTRONIC MATERIALS
Appears in Collections:	[Institute of Materials Science and Engineering] journal & Dissertation

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