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    Please use this identifier to cite or link to this item: http://ir.lib.ncu.edu.tw/handle/987654321/30302


    Title: Cross-interaction between Ni and Cu across Sn layers with different thickness
    Authors: Chang,Chien Wei;Yang,Su Chun;Tu,Chun-Te;Kao,C. Robert
    Contributors: 化學工程與材料工程研究所
    Keywords: LEAD-FREE SOLDERS;INTERFACIAL REACTIONS;SURFACE FINISH;DIFFUSION;JOINTS;COPPER;TIN
    Date: 2007
    Issue Date: 2010-07-06 16:16:23 (UTC+8)
    Publisher: 中央大學
    Abstract: The Ni/solder/Cu material sequence is one of the most common material sequences in the solder joints of electronic packages. In this study, the Ni/Sn/ Cu ternary diffusion couples were used to investigate the solder volume effect on the cross-interaction
    Relation: JOURNAL OF ELECTRONIC MATERIALS
    Appears in Collections:[化學工程與材料工程研究所] 期刊論文

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