Electromigration-induced microstructure evolution in tin studied by synchrotron x-ray microdiffraction

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Please use this identifier to cite or link to this item: http://ir.lib.ncu.edu.tw/handle/987654321/30612

Title:	Electromigration-induced microstructure evolution in tin studied by synchrotron x-ray microdiffraction
Authors:	Wu,AT;Tu,KN;Lloyd,JR;Tamura,N;Valek,BC;Kao,CR
Contributors:	化學工程與材料工程研究所
Keywords:	IN-SITU;ALUMINUM;LINES;INTERCONNECTS;CONDUCTORS
Date:	2004
Issue Date:	2010-07-06 16:23:22 (UTC+8)
Publisher:	中央大學
Abstract:	Under constant current electromigration, white tin exhibited a resistance drop of up to 10%. It has a body-centered-tetragonal structure, and the resistivity along the a and b axes is 35% smaller than along the c axis. Microstructure evolution under elect
Relation:	APPLIED PHYSICS LETTERS
Appears in Collections:	[National Central University Department of Chemical & Materials Engineering] journal & Dissertation

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