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    Please use this identifier to cite or link to this item: http://ir.lib.ncu.edu.tw/handle/987654321/30801

    Title: Effect of Cu concentration on the interfacial reactions between Ni and Sn-Cu solders
    Authors: Chen,WT;Ho,CE;Kao,CR
    Contributors: 化學工程與材料工程研究所
    Keywords: TIN
    Date: 2002
    Issue Date: 2010-07-06 16:27:40 (UTC+8)
    Publisher: 中央大學
    Abstract: The eutectic 99.3Sn-0.7Cu solder (wt%, Sn-0.7Cu) is the most promising lead-free replacement for the eutectic Sn-Pb solder in wave-soldering applications. In this study, the effect of a small perturbation in the Cu concentration on the reaction between th
    Appears in Collections:[化學工程與材料工程研究所] 期刊論文

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