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    Please use this identifier to cite or link to this item: http://ir.lib.ncu.edu.tw/handle/987654321/30916

    Title: Interactions between solder and metallization during long-term aging of advanced microelectronic packages
    Authors: Ho,CE;Chen,WT;Kao,CR
    Contributors: 化學工程與材料工程研究所
    Keywords: JOINTS;GROWTH
    Date: 2001
    Issue Date: 2010-07-06 16:30:23 (UTC+8)
    Publisher: 中央大學
    Abstract: The reactions between the eutectic PbSn solder and the Au/Ni/Cu tri-layer metallization in advanced microelectronic packages were studied. In this investigation, reflowed packages were subjected to aging at 160 degreesC for times as long as 4000 h. Immedi
    Appears in Collections:[化學工程與材料工程研究所] 期刊論文

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