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显示项目311-320 / 920. (共92页) << < 2 3 4 5 6 7 8 9 10 11 > >> 每页显示[10|25|50]项目

日期	题名	作者
2004	Chain persistency in single-stranded DNA	Sain,A; Ha,BY; Tsao,HK; Chen,JZY
2004	Charge renormalization of charged spheres based on thermodynamic properties	Hsin,WL; Wang,TY; Sheng,YJ; Tsao,HK
2004	Correlation between interfacial reactions and mechanical strengths of Sn(Cu)/Ni(P) solder bumps	Wang,SJ; Kao,HJ; Liu,CY
2004	Cross-interaction of under-bump metallurgy and surface finish in flip-chip solder joints	Tsai,CM; Luo,WC; Chang,CW; Shieh,YC; Kao,CR
2004	Effect of calcination temperature on catalyst reducibility and hydrogenation reactivity in rice husk ash-alumina supported nickel systems	Chang,FW; Kuo,MS; Tsay,MT; Hsieh,MC
2004	Effect of fluoroalkyl substituents on the reactions of alkylchlorosilanes with mold surfaces for nanoimprint lithography	Chen,JK; Ko,FH; Hsieh,KF; Chou,CT; Chang,FC
2004	Effect of pH on the production and molecular weight distribution of exopolysaccharide by Antrodia camphorata in batch cultures	Shu,CH; Lung,MY
2004	Effects of culture pm on the production of bioactive polysaccharides by Agaricus blazei in batch cultures	Shu,CH; Lin,KJ; Wen,BJ
2004	Effects of surfactant micelles on viscosity and conductivity of poly(ethylene glycol) solutions	Wang,SC; Wei,TC; Chen,WB; Tsao,HK
2004	Effects of the gold thickness of the surface finish on the interfacial reactions in flip-chip solder joints	Lin,YL; Luo,WC; Lin,YH; Ho,CE; Kao,CR

显示项目311-320 / 920. (共92页) << < 2 3 4 5 6 7 8 9 10 11 > >> 每页显示[10|25|50]项目