English  |  正體中文  |  简体中文  |  Items with full text/Total items : 75369/75369 (100%)
Visitors : 25602235      Online Users : 479
RC Version 7.0 © Powered By DSPACE, MIT. Enhanced by NTU Library IR team.
Scope Tips:
  • please add "double quotation mark" for query phrases to get precise results
  • please goto advance search for comprehansive author search
  • Adv. Search
    HomeLoginUploadHelpAboutAdminister Goto mobile version


    Loading community tree, please wait....


    Loading year class tree, please wait....

    Items for Author "Kao,CR" 

    Return to Browse by Author

    Showing 43 items.

    Collection Date Title Authors Bitstream
    [化學工程與材料工程研究所] 期刊論文 2009 Special Issue: 2009 Pb-Free Solders - Foreword Kang,SK; Anderson,I; Chada,S; Duh,JG; Turbini,LJ; Wu,A; Kao,CR; Hua,F; Subramanian,KN; Frear,D; Handwerker,C; Guo,F; Chawla,N; Zeng,KJ
    [化學工程與材料工程研究所] 期刊論文 2005 Controlling the microstructures from the gold-tin reaction Tsai,JY; Chang,CW; Shieh,YC; Hu,YC; Kao,CR
    [化學工程與材料工程研究所] 期刊論文 2005 Electromigration induced metal dissolution in flip-chip solder joints Lin,YH; Tsai,CM; Hu,YC; Lin,YL; Tsai,JY; Kao,CR
    [化學工程與材料工程研究所] 期刊論文 2005 Electromigration-induced failure in flip-chip solder joints Lin,YH; Tsai,CM; Hu,YC; Lin,YL; Kao,CR
    [化學工程與材料工程研究所] 期刊論文 2005 Electromigration-induced grain rotation in anisotropic conducting beta tin Wu,AT; Gusak,AM; Tu,KN; Kao,CR
    [化學工程與材料工程研究所] 期刊論文 2004 Cross-interaction of under-bump metallurgy and surface finish in flip-chip solder joints Tsai,CM; Luo,WC; Chang,CW; Shieh,YC; Kao,CR
    [化學工程與材料工程研究所] 期刊論文 2004 Effects of the gold thickness of the surface finish on the interfacial reactions in flip-chip solder joints Lin,YL; Luo,WC; Lin,YH; Ho,CE; Kao,CR
    [化學工程與材料工程研究所] 期刊論文 2004 Electromigration-induced microstructure evolution in tin studied by synchrotron x-ray microdiffraction Wu,AT; Tu,KN; Lloyd,JR; Tamura,N; Valek,BC; Kao,CR
    [化學工程與材料工程研究所] 期刊論文 2004 Special issue on Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials III - Foreword Kao,CR; Chen,SW; Lee,HM; Mohney,SE; Notis,MR; Swenson,DJ
    [化學工程與材料工程研究所] 期刊論文 2003 A study on the reaction between cu and Sn3.5Ag solder doped with small amounts of Ni Tsai,JY; Hu,YC; Tsai,CM; Kao,CR
    [化學工程與材料工程研究所] 期刊論文 2003 Chemical reaction in solder joints of microelectronic packages Ho,CE; Lin,YL; Tsai,JY; Kao,CR
    [化學工程與材料工程研究所] 期刊論文 2003 Electromigration failure in flip chip solder joints due to rapid dissolution of copper Hu,YC; Lin,YH; Kao,CR; Tu,KN
    [化學工程與材料工程研究所] 期刊論文 2003 Recent progress in phase diagram calculation and application Kao,CR
    [化學工程與材料工程研究所] 期刊論文 2003 Special issue on lead-free solders and processing issues in microelectronic packaging - Foreword Lucas,JP; Chada,S; Kang,SK; Kao,CR; Lin,KL; Ready,J; Yu,J
    [化學工程與材料工程研究所] 期刊論文 2003 Special issue on phase stability, phase transformations, and reactive phase formation in electronic materials - Foreword Chen,SW; Lee,HM; Swenson,D; Kao,CR; Mohney,SE; Notis,MR; Schmid-Fetzer,R
    [化學工程與材料工程研究所] 期刊論文 2002 Effect of Cu concentration on the interfacial reactions between Ni and Sn-Cu solders Chen,WT; Ho,CE; Kao,CR
    [化學工程與材料工程研究所] 期刊論文 2002 Effect of Cu concentration on the reactions between Sn-Ag-Cu solders and Ni Ho,CE; Tsai,RY; Lin,YL; Kao,CR
    [化學工程與材料工程研究所] 期刊論文 2002 Inhibiting the formation of (Au1-xNix)Sn-4 and reducing the consumption of Ni metallization in solder joints Ho,CE; Shiau,LC; Kao,CR
    [化學工程與材料工程研究所] 期刊論文 2002 Phase diagrams of important electronic materials Kao,CR
    [化學工程與材料工程研究所] 期刊論文 2002 Reactions between Sn-Ag-Cu lead-free solders and the Au/Ni surface finish in advanced electronic packages Shiau,LC; Ho,CE; Kao,CR
    [化學工程與材料工程研究所] 期刊論文 2002 Strong effect of Cu concentration on the reaction between lead-free microelectronic solders and Ni Ho,CE; Lin,YL; Kao,CR
    [化學工程與材料工程研究所] 期刊論文 2001 Interactions between solder and metallization during long-term aging of advanced microelectronic packages Ho,CE; Chen,WT; Kao,CR
    [化學工程與材料工程研究所] 期刊論文 2001 Reaction of solder with Ni/Au metallization for electronic packages during reflow soldering Ho,CE; Tsai,SY; Kao,CR
    [化學工程與材料工程研究所] 期刊論文 2001 Reflow soldering and isothermal solid-state aging of Sn-Ag eutectic solder on Au/Ni surface finish Liu,CM; Ho,CE; Chen,WT; Kao,CR
    [化學工程與材料工程研究所] 期刊論文 2001 Selective interfacial reaction between Ni and eutectic BiSn lead-free solder Tao,WH; Chen,C; Ho,CE; Chen,WT; Kao,CR
    [化學工程與材料工程研究所] 期刊論文 2001 Special issue on lead-free solder materials and soldering technologies - Foreword Kang,SK; Mavoori,H; Chada,S; Kao,CR; Smith,RW
    [化學工程與材料工程研究所] 期刊論文 2000 Formation and resettlement of (AuxNi1-x)Sn-4 in solder joints of ball-grid-array packages with the Au/Ni surface finish Ho,CE; Zheng,R; Luo,GL; Lin,AH; Kao,CR
    [化學工程與材料工程研究所] 期刊論文 2000 Long-term aging study on the solid-state reaction between 58Bi42Sn solder and Ni substrate Chen,C; Ho,CE; Lin,AH; Luo,GL; Kao,CR
    [化學工程與材料工程研究所] 期刊論文 2000 Optimizing the wire-bonding parameters for second bonds in ball grid array packages Ho,CE; Chen,C; Kao,CR
    [化學工程與材料工程研究所] 期刊論文 1999 Binary compounds in the Ge-Ti system Jain,TA; Kao,CR
    [化學工程與材料工程研究所] 期刊論文 1999 Formation and absence of intermetallic compounds during solid-state reactions in the Ni-Bi system Lee,MS; Chen,C; Kao,CR
    [化學工程與材料工程研究所] 期刊論文 1999 Interfacial reactions between Ni substrate and the component Bi in solders Lee,MS; Liu,CM; Kao,CR
    [化學工程與材料工程研究所] 期刊論文 1999 Phase relation in the titanium-rich region of the Ge-Si-Ti ternary system Jain,TA; Huang,CG; Ho,CE; Kao,CR
    [化學工程與材料工程研究所] 期刊論文 1999 Reaction kinetics of solder-balls with pads in BGA packages during reflow soldering Ho,CE; Chen,YM; Kao,CR
    [化學工程與材料工程研究所] 期刊論文 1999 Schottky enhancement of contacts to n-GaAs via the exchange mechanism using NiAlxGa1-x as a metallization Chen,CP; Lin,CF; Swenson,D; Kao,CR; Jan,CH; Chang,YA
    [化學工程與材料工程研究所] 期刊論文 1998 Phase equilibria of the Si-Ge-Ti system relevant to the reactions between SiGe alloys and Ti Jain,TA; Kao,CR
    [化學工程與材料工程研究所] 期刊論文 1997 Calculation of low-temperature phase equilibria in the indium-lead system Kao,CR
    [化學工程與材料工程研究所] 期刊論文 1997 Microstructures developed in solid-liquid reactions: using Cu-Sn reaction, Ni-Bi reaction, and Cu-In reaction as examples Kao,CR
    [化學工程與材料工程研究所] 期刊論文 1997 Reactions of solid copper with pure liquid tin and liquid tin saturated with copper Hayashi,A; Kao,CR; Chang,YA
    [化學工程與材料工程研究所] 期刊論文 1996 A mechanism for reactive diffusion between Si single crystal and NbC powder compact Kao,CR; Woodford,J; Chang,YA
    [化學工程與材料工程研究所] 期刊論文 1996 On the relationships between the self-diffusion parameters and the thermodynamic properties in B2 intermetallic compounds Kao,CR
    [材料科學與工程研究所 ] 期刊論文 2005 In situ observation of the void formation-and-propagation mechanism in solder joints under current-stressing Lin,YH; Hu,YC; Tsai,CM; Kao,CR; Tu,KN
    [材料科學與工程研究所 ] 期刊論文 2005 Solid-state reactions between Ni and Sn-Ag-Cu solders with different Cu concentrations Luo,WC; Ho,CE; Tsai,JY; Lin,YL; Kao,CR

    ::: Copyright National Central University. | 國立中央大學圖書館版權所有 | 收藏本站 | 設為首頁 | 最佳瀏覽畫面: 1024*768 | 建站日期:8-24-2009 :::
    DSpace Software Copyright © 2002-2004  MIT &  Hewlett-Packard  /   Enhanced by   NTU Library IR team Copyright ©   - 隱私權政策聲明