中大機構典藏-NCU Institutional Repository-提供博碩士論文、考古題、期刊論文、研究計畫等下載:Items for Author

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Collection	Date	Title	Authors
[化學工程與材料工程研究所] 期刊論文	2005	Electromigration-induced grain rotation in anisotropic conducting beta tin	Wu,AT; Gusak,AM; Tu,KN; Kao,CR
[化學工程與材料工程研究所] 期刊論文	2004	Electromigration-induced microstructure evolution in tin studied by synchrotron x-ray microdiffraction	Wu,AT; Tu,KN; Lloyd,JR; Tamura,N; Valek,BC; Kao,CR
[化學工程與材料工程研究所] 期刊論文	2003	Electromigration failure in flip chip solder joints due to rapid dissolution of copper	Hu,YC; Lin,YH; Kao,CR; Tu,KN
[化學工程與材料工程學系 ] 期刊論文	2011	Preferred orientation relationships with large misfit interfaces between Ni(3)Sn(4) and Ni in reactive wetting of eutectic SnPb on Ni	Suh,JO; Tu,KN; Wu,AT; Tamura,N
[材料科學與工程研究所 ] 期刊論文	2005	In situ observation of the void formation-and-propagation mechanism in solder joints under current-stressing	Lin,YH; Hu,YC; Tsai,CM; Kao,CR; Tu,KN