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    Please use this identifier to cite or link to this item: http://ir.lib.ncu.edu.tw/handle/987654321/49962

    Title: Preferred orientation relationships with large misfit interfaces between Ni(3)Sn(4) and Ni in reactive wetting of eutectic SnPb on Ni
    Authors: Suh,JO;Tu,KN;Wu,AT;Tamura,N
    Contributors: 化學工程與材料工程學系
    Date: 2011
    Issue Date: 2012-03-27 16:27:30 (UTC+8)
    Publisher: 國立中央大學
    Abstract: Ni(3)Sn(4) grains were formed on Ni by reactive wetting between molten eutectic SnPb and thermally annealed Ni foil. Using synchrotron white beam micro x-ray diffraction analysis, two kinds of preferred orientation relationships between Ni(3)Sn(4) and Ni were found. The existence of preferred orientation with large interfacial misfit is suggested as a general mechanism of intermetallic compound formation in reactive solder wetting on metals. (C) 2011 American Institute of Physics. [doi:10.1063/1.3592184]
    Appears in Collections:[化學工程與材料工程學系 ] 期刊論文

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