Preferred orientation relationships with large misfit interfaces between Ni(3)Sn(4) and Ni in reactive wetting of eutectic SnPb on Ni

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Title:	Preferred orientation relationships with large misfit interfaces between Ni(3)Sn(4) and Ni in reactive wetting of eutectic SnPb on Ni
Authors:	Suh,JO;Tu,KN;Wu,AT;Tamura,N
Contributors:	化學工程與材料工程學系
Date:	2011
Issue Date:	2012-03-27 16:27:30 (UTC+8)
Publisher:	國立中央大學
Abstract:	Ni(3)Sn(4) grains were formed on Ni by reactive wetting between molten eutectic SnPb and thermally annealed Ni foil. Using synchrotron white beam micro x-ray diffraction analysis, two kinds of preferred orientation relationships between Ni(3)Sn(4) and Ni were found. The existence of preferred orientation with large interfacial misfit is suggested as a general mechanism of intermetallic compound formation in reactive solder wetting on metals. (C) 2011 American Institute of Physics. [doi:10.1063/1.3592184]
Relation:	JOURNAL OF APPLIED PHYSICS
Appears in Collections:	[Department of Chemical and Materials Engineering] journal & Dissertation

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