Preferred orientation relationships with large misfit interfaces between Ni(3)Sn(4) and Ni in reactive wetting of eutectic SnPb on Ni

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题名:	Preferred orientation relationships with large misfit interfaces between Ni(3)Sn(4) and Ni in reactive wetting of eutectic SnPb on Ni
作者:	Suh,JO;Tu,KN;Wu,AT;Tamura,N
贡献者:	化學工程與材料工程學系
日期:	2011
上传时间:	2012-03-27 16:27:30 (UTC+8)
出版者:	國立中央大學
摘要:	Ni(3)Sn(4) grains were formed on Ni by reactive wetting between molten eutectic SnPb and thermally annealed Ni foil. Using synchrotron white beam micro x-ray diffraction analysis, two kinds of preferred orientation relationships between Ni(3)Sn(4) and Ni were found. The existence of preferred orientation with large interfacial misfit is suggested as a general mechanism of intermetallic compound formation in reactive solder wetting on metals. (C) 2011 American Institute of Physics. [doi:10.1063/1.3592184]
關聯:	JOURNAL OF APPLIED PHYSICS
显示于类别:	[化學工程與材料工程學系 ] 期刊論文

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