多孔矽（Porous Silicon）由於其高比表面積和生物相容性，廣泛應用於奈米科技領域的材料。然而，其製造過程存在成本高昂、區域控制難度高、效率低下等問題。本實驗以金屬輔助化學蝕刻這個多孔矽製造中成本相對低廉的製造方法為著眼點，並以無電沉積這個金屬沉積方式進行改良，融合了無電沉積和液滴沉積技術，以實現簡單且迅速的區域沉積，同時降低了製程成本。深入研究影響液滴無電沉積的各種參數之間的關聯性，這有助於優化製程，找出適合不同情況下使用的參數。再將液滴沉積技術擴展到金屬輔助化學蝕刻製程，以實現更加簡便和高效的區域蝕刻，提高製程的靈活性。最重要的是，我們以此尋求創造多孔矽的圖案化可能性，希望面向更廣泛的應用領域。;Porous Silicon is widely used as a material in the field of nanotechnology due to its high specific surface area and biocompatibility. However, the manufacturing process of porous silicon is characterized by high cost, difficult area control, and low efficiency. In this experiment, we focused on metal-assisted chemical etching, a relatively low-cost method for porous silicon fabrication, and enhanced electroless deposition, a metal deposition method, by combining electroless deposition and droplet deposition to realize simple and fast regional deposition while reducing the cost of the process. An in-depth study of the correlation between the various parameters affecting droplet electroless deposition helps to optimize the process and find the right parameters for different situations. We then extend the droplet deposition process to metal-assisted chemical etching processes to enable easier and more efficient area etching and to increase process flexibility. Most importantly, we are looking for the possibility of creating patterned porous silicon for a wider range of applications.
