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    "Dow, Wei-Ping"的相关文件  

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    类别 日期 题名 作者 档案
    [化學學系] 期刊論文 2016-09-01 In situ STM imaging of polyethylene glycol adsorbed on an Au(111) electrode in pH 3 姚學麟; Li, Lai-Han; Yau, Shuehlin; Dow, Wei-Ping
    [化學學系] 期刊論文 2016-06-10 Electrodeposition of copper on an Au(111) electrode modified with mercaptoacetic acid in sulfuric acid 姚學麟; Lai, Chao-Shan; Hu, Xiao-Xuan; Yau, Shuehlin; Dow, Wei-Ping; Lee, Yuh-Lang
    [化學學系] 期刊論文 2014-01-01 In situ scanning tunneling microscopy imaging self-assembled monolayers of mercaptoacetic acid and cupric ion on Au(111) electrode 姚學麟; Lai, Chao-Shan; Chen, Yu-Ying; Yau, Shuehlin; Dow, Wei-Ping; Lee, Yuh-Lang
    [化學學系] 期刊論文 2013-12-01 Scanning tunneling microscopy of superfilling in formula containing chloride, polyethylene glycol and bis-3-sodiumsulfopropyl-disulfide 姚學麟; Fu, Yunlin; Chen, Sihzih; Yau, Shuehlin; Dow, Wei-Ping; Lee, Yuh-Lang
    [化學學系] 期刊論文 2013-12-01 Use of 3,3-thiobis(1-propanesulfonate) to accelerate microvia filling by copper electroplating 姚學麟; Chan, Po-Fan; Chiu, Yong-Da; Dow, Wei-Ping; Krug, Klaus; Lee, Yuh-Lang; Yau, Shueh-Lin
    [化學學系] 期刊論文 2012-10-09 Adsorption and desorption of bis-(3-sulfopropyl) disulfide during cu electrodeposition and stripping at Au electrodes 姚學麟; Chiu, Yong-Da; Dow, Wei-Ping; Krug, Klaus; Liu, Yung-Fang; Lee, Yuh-Lang; Yau, Shueh-Lin
    [化學學系] 期刊論文 2012-08-23 Electrochemical Cu growth on MPS-modified Au(111) electrodes 姚學麟; Krug, Klaus; Liu, Yung-Fang; Ho, Wen-Hsiang; Lee, Yuh-Lang; Dow, Wei-Ping; Yau, Shueh-Lin
    [化學學系] 期刊論文 2012-07-03 Electrodeposition of copper on a Pt(111) electrode in sulfuric acid containing poly(ethylene glycol) and chloride ions as probed by in situ STM 姚學麟; Fu, YunLin; Pao, Te; Chen, Sih-Zih; Yau, ShuehLin; Dow, Wei-Ping; Lee, Yuh-Lang
    [化學學系] 期刊論文 2012-01-06 In situ STM study of Cu electrodeposition on TBPS-modified Au(111) electrodes 姚學麟; Liu, Yung-Fang; Krug, Klaus; Lin, Pin-Chun; Chiu, Yong-Da; Dow, Wei-Ping; Yau, Shueh-Lin; Lee, Yuh-Lang

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