English  |  正體中文  |  简体中文  |  Items with full text/Total items : 80990/80990 (100%)
Visitors : 41655041      Online Users : 2252
RC Version 7.0 © Powered By DSPACE, MIT. Enhanced by NTU Library IR team.
Scope Tips:
  • please add "double quotation mark" for query phrases to get precise results
  • please goto advance search for comprehansive author search
    •  Adv. Search
    Home ‧ Login ‧ Upload ‧ Help ‧ About ‧ Administer Goto mobile version

    Category

    Loading community tree, please wait....

    Year

    Loading year class tree, please wait....

    Items for Author "Kao,C. R." 

    Return to Browse by Author

    Showing 9 items.

    Collection Date Title Authors Bitstream
    [化學工程與材料工程研究所] 期刊論文 2008 Effect of UBM thickness on the mean time to failure of flip-chip solder joints under electromigration Lin,Y. L.; Lai,Y. S.; Lin,Y. W.; Kao,C. R.
    [化學工程與材料工程研究所] 期刊論文 2008 Pronounced electromigration of Cu in molten Sn-based solders Huang,J. R.; Tsai,C. M.; Lin,Y. W.; Kao,C. R.
    [化學工程與材料工程研究所] 期刊論文 2008 Tin whisker growth induced by high electron current density Lin,Y. W.; Lai,Yi-Shao; Lin,Y. L.; Tu,Chun-Te; Kao,C. R.
    [化學工程與材料工程研究所] 期刊論文 2007 Interfacial reaction issues for lead-free electronic solders Ho,C. E.; Yang,S. C.; Kao,C. R.
    [化學工程與材料工程研究所] 期刊論文 2007 Massive spalling of intermetallic compounds in solder-substrate reactions due to limited supply of the active element Yang,S. C.; Ho,C. E.; Chang,C. W.; Kao,C. R.
    [化學工程與材料工程研究所] 期刊論文 2006 Effect of surface finish on the failure mechanisms of flip-chip solder joints under electromigration Lin,Y. L.; Lai,Y. S.; Tsai,C. M.; Kao,C. R.
    [化學工程與材料工程研究所] 期刊論文 2006 In-situ observation of material migration in flip-chip solder joints under current stressing Tsai,C. M.; Lai,Yi-Shao; Lin,Y. L.; Chang,C. W.; Kao,C. R.
    [化學工程與材料工程研究所] 期刊論文 2006 Kinetics of AuSn4 migration in lead-free solders Chang,C. W.; Ho,C. E.; Yang,S. C.; Kao,C. R.
    [化學工程與材料工程研究所] 期刊論文 2006 Strong Zn concentration effect on the soldering reactions between Sn-based solders and Cu Yang,S. C.; Ho,C. E.; Chang,C. W.; Kao,C. R.

    ::: Copyright National Central University. | 國立中央大學圖書館版權所有 | 收藏本站 | 設為首頁 | 最佳瀏覽畫面: 1024*768 | 建站日期：8-24-2009 :::
    DSpace Software Copyright © 2002-2004  MIT &  Hewlett-Packard  /   Enhanced by   NTU Library IR team Copyright ©   - 隱私權政策聲明