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    Please use this identifier to cite or link to this item: http://ir.lib.ncu.edu.tw/handle/987654321/30497


    Title: Electromigration induced metal dissolution in flip-chip solder joints
    Authors: Lin,YH;Tsai,CM;Hu,YC;Lin,YL;Tsai,JY;Kao,CR
    Contributors: 化學工程與材料工程研究所
    Keywords: FAILURE
    Date: 2005
    Issue Date: 2010-07-06 16:20:44 (UTC+8)
    Publisher: 中央大學
    Abstract: The failure of flip chip solder joints through the dissolution of the Cu metallization was studied. From the location and geometry of the dissolved Cu, it can be concluded that current crowding played a critical role in the dissolution. It can also be con
    Relation: PRICM 5: THE FIFTH PACIFIC RIM INTERNATIONAL CONFERENCE ON ADVANCED MATERIALS AND PROCESSING, PTS 1-5
    Appears in Collections:[化學工程與材料工程研究所] 期刊論文

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