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    Please use this identifier to cite or link to this item: http://ir.lib.ncu.edu.tw/handle/987654321/30522


    Title: Metallurgical reactions of Sn-3.5Ag solder with various thicknesses of electroplated Ni/Cu under bump metallization
    Authors: Huang,CP;Chen,C;Liu,CY;Lin,SS;Chen,KH
    Contributors: 化學工程與材料工程研究所
    Keywords: INTERFACIAL REACTION;EUTECTIC SNPB;THIN-FILMS;JOINTS;MICROSTRUCTURE;RELIABILITY;TECHNOLOGY;BEHAVIOR;CU
    Date: 2005
    Issue Date: 2010-07-06 16:21:16 (UTC+8)
    Publisher: 中央大學
    Abstract: Nickel has been widely used as an under-bump metallization (UBM) material in the microelectronics industry. The solid-state reaction between the eutectic SnAg solder bumps and three thicknesses of Ni/Cu UBM was investigated, with 5 mu m-Cu/3 mu m-Ni, 3 mu
    Relation: JOURNAL OF MATERIALS RESEARCH
    Appears in Collections:[化學工程與材料工程研究所] 期刊論文

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