本論文提出一雷射掃描晶圓定位系統用來量測集束型設備中晶圓的 圓心位置。此定位系統是由雷射掃描系統與散射光偵測系統組成。利用振鏡 掃描器將雷射光線反射至感測區域形成一道掃描光線。當機械手臂輸送晶圓 通過掃描光線時，散射光偵測系統將接收到一光強度隨時間變化之散射光時 序訊號。根據散射光時序訊號與已知的速度及位置參數，晶圓位置演算法便 可計算出機械手臂運動速度與晶圓圓心位置。 為驗證系統之定位能力，使用四吋晶圓進行實驗。在以實驗速度為速度 參數之實驗中，定位精確度小於1.5mm；在以理論速度為速度參數之實驗中 ，定位精確度則皆小於0.1mm。本系統亦可用於速度量測，速度量測之絕對 誤差小於1mm/s，量測精確度則低於0.7mm/s。 A laser scanning method for wafer positioning is proposeed to determine the center position of the wafer in the cluster tool. This positioning system incorporates a laser scanning system and a scattering light receiving system. The scanner is used to reflect a laser beam into a scanning line on the sensing area. As the wafer passes by the scanning line, a scattering light receiving system detects the time-sequence signal of the scattered lights. The velocity of a robot plate and the position of wafer ia determined by signal processing of the time-sequence signal. 4-inch wafer positioning experiment results demonstrate that the positioning system can be used to detectc the positioning of a wafer. The velocity measurement precision is under 0.7 mm/s, and the absolut error is about 1 mm/s. The wafer positioning precision is 0.1 mm.
