可攜式電子產品的強勁成長動能帶動高效能微小化晶片的龐大需求，晶圓級封裝居中扮演重要的角色，使IC封裝更趨於輕薄短小，應用範圍也更趨廣泛。然而，在全球化及產業蓬勃發展高度競爭下，半導體封裝代工因低毛利及高建置成本首當其衝面臨挑戰，企業為免於市場競爭所淘汰，無不為提升自家公司競爭力作努力。然而，節省生產成本的關鍵在於生產力的提升，如何透過自動化生產技術獲得生產力的改善，是企業永續經營的關鍵之一。 晶圓級封裝因屬資本及勞力密集產業，龐大的人力開銷伴隨著逐年調漲之勞工基本工資，直接衝擊並壓縮企業的獲利。當前自動化光學檢測（AOI）雖已普遍應用於製程中作「晶圓式」檢驗，卻無法用以取代人力比重最高之「晶粒」目視檢驗工作站。本研究為此發展一套適用於晶圓級影像感測IC之「晶粒式」自動光學檢測儀器，目的為導入人力比重最高之最終目視檢驗工作站以取代人力、降低成本，期望在未來能夠全面應用於全檢產品之外觀檢驗。 ;Portable electronic products has strong growth momentum led to huge demand of highly effective miniaturized chips. Wafer level chip scale package (WLCSP) as intermediary, plays an important role, making IC packages tend to be more thin and short in widespread use. However, under the globalization and the highly competitive industry, semiconductor foundry under the low margins and high-cost challenges facing the brunt, try all means to enhance the competitiveness of their firms. At the same time, savings in production costs is the key to improve the productivity, through automated production technology, productivity improvements can be achieve. It is one key to business continuity management. Wafer level chip scale package is capital and labor-intensive industries, a huge human cost accompanied by a yearly increase of basic salary. It has a direct impact and compression to the enterprise′s profit. Currently, automatic optical inspection (AOI) machine has been widely used in manufacturing process for "wafer type" test but, not enough to replace human as the highest proportion of "die" visual inspection station. This research develops a convenient wafer level image sensing IC "die" automated optical inspection equipment aimed to import manpower to the highest proportion of "final visual inspection" workstations. We hope to fully apply it to the full inspection product in the future.
