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    Please use this identifier to cite or link to this item: http://ir.lib.ncu.edu.tw/handle/987654321/68053

    Title: 晶圓級封裝晶粒檢測自動化研究 -以X公司最終檢驗站為研究對象
    Authors: 蕭毓則;Hsiao,Yu-tse
    Contributors: 工業管理研究所
    Keywords: 晶圓級封裝;影像感測;自動光學檢測;AOI;WLCSP;Image Sensor;Automatic Optical Inspection;AOI
    Date: 2015-07-06
    Issue Date: 2015-09-23 10:19:46 (UTC+8)
    Publisher: 國立中央大學
    Abstract: 可攜式電子產品的強勁成長動能帶動高效能微小化晶片的龐大需求,晶圓級封裝居中扮演重要的角色,使IC封裝更趨於輕薄短小,應用範圍也更趨廣泛。然而,在全球化及產業蓬勃發展高度競爭下,半導體封裝代工因低毛利及高建置成本首當其衝面臨挑戰,企業為免於市場競爭所淘汰,無不為提升自家公司競爭力作努力。然而,節省生產成本的關鍵在於生產力的提升,如何透過自動化生產技術獲得生產力的改善,是企業永續經營的關鍵之一。
    ;Portable electronic products has strong growth momentum led to huge demand of highly effective miniaturized chips. Wafer level chip scale package (WLCSP) as intermediary, plays an important role, making IC packages tend to be more thin and short in widespread use. However, under the globalization and the highly competitive industry, semiconductor foundry under the low margins and high-cost challenges facing the brunt, try all means to enhance the competitiveness of their firms. At the same time, savings in production costs is the key to improve the productivity, through automated production technology, productivity improvements can be achieve. It is one key to business continuity management.
    Wafer level chip scale package is capital and labor-intensive industries, a huge human cost accompanied by a yearly increase of basic salary. It has a direct impact and compression to the enterprise′s profit. Currently, automatic optical inspection (AOI) machine has been widely used in manufacturing process for "wafer type" test but, not enough to replace human as the highest proportion of "die" visual inspection station. This research develops a convenient wafer level image sensing IC "die" automated optical inspection equipment aimed to import manpower to the highest proportion of "final visual inspection" workstations. We hope to fully apply it to the full inspection product in the future.
    Appears in Collections:[工業管理研究所 ] 博碩士論文

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