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    Items for Author "Kao,C. R." 

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    Showing 9 items.

    Collection Date Title Authors Bitstream
    [化學工程與材料工程研究所] 期刊論文 2008 Effect of UBM thickness on the mean time to failure of flip-chip solder joints under electromigration Lin,Y. L.; Lai,Y. S.; Lin,Y. W.; Kao,C. R.
    [化學工程與材料工程研究所] 期刊論文 2008 Pronounced electromigration of Cu in molten Sn-based solders Huang,J. R.; Tsai,C. M.; Lin,Y. W.; Kao,C. R.
    [化學工程與材料工程研究所] 期刊論文 2008 Tin whisker growth induced by high electron current density Lin,Y. W.; Lai,Yi-Shao; Lin,Y. L.; Tu,Chun-Te; Kao,C. R.
    [化學工程與材料工程研究所] 期刊論文 2007 Interfacial reaction issues for lead-free electronic solders Ho,C. E.; Yang,S. C.; Kao,C. R.
    [化學工程與材料工程研究所] 期刊論文 2007 Massive spalling of intermetallic compounds in solder-substrate reactions due to limited supply of the active element Yang,S. C.; Ho,C. E.; Chang,C. W.; Kao,C. R.
    [化學工程與材料工程研究所] 期刊論文 2006 Effect of surface finish on the failure mechanisms of flip-chip solder joints under electromigration Lin,Y. L.; Lai,Y. S.; Tsai,C. M.; Kao,C. R.
    [化學工程與材料工程研究所] 期刊論文 2006 In-situ observation of material migration in flip-chip solder joints under current stressing Tsai,C. M.; Lai,Yi-Shao; Lin,Y. L.; Chang,C. W.; Kao,C. R.
    [化學工程與材料工程研究所] 期刊論文 2006 Kinetics of AuSn4 migration in lead-free solders Chang,C. W.; Ho,C. E.; Yang,S. C.; Kao,C. R.
    [化學工程與材料工程研究所] 期刊論文 2006 Strong Zn concentration effect on the soldering reactions between Sn-based solders and Cu Yang,S. C.; Ho,C. E.; Chang,C. W.; Kao,C. R.

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