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    近3年内发表的文件: 109(15.53%)
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    显示项目676-700 / 702. (共29页)
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    日期题名作者
    2007 Sublimation point depression of tris(8-hydroxyquinoline)aluminum(III) (Alq3) by crystal engineering Lee,Tu; Lin,Ming Shiou
    2007 The effect of thermomigration on phase coarsening in a eutectic SnPb alloy Chuang,Y. C.; Liu,C. Y.
    2006 Asymmetrical solder microstructure in Ni/Sn/Cu solder joint Wang,S. J.; Liu,C. Y.
    2006 Creep properties of Sn-3.5Ag-0.5Cu lead-free solder under step-loading Lin,Chih-Kuang; Teng,Hsuan-Yu
    2006 Cross-interaction between Au and Cu in Au/Sn/Cu ternary diffusion couples Chang CW,Lee QP,Ho CE,Kao CR
    2006 Current density dependence of electromigration-induced flip-chip Cu pad consumption Lin,C. T.; Chuang,Y. C.; Wang,S. J.; Liu,C. Y.
    2006 Effect of Fe and Si on properties of squeezed aluminium metal matrix Nd-Fe-B composite magnets Chuang,S. -F.; Lee,S. -L.; Lin,F. -J.; Lin,J. -C.
    2006 Effect of heat treatments on the tensile strength and SCC-resistance of AA7050 in an alkaline saline solution Lin,Jing-Chie; Liao,Hsueh-Lung; Jehng,Wern-Dare; Chang,Chih-Horng; Lee,Sheng-Long
    2006 Effects of limited Cu supply on soldering reactions between SnAgCu and Ni Ho CE,Lin YW,Yang SC,Kao CR,Jiang DS
    2006 Effects of strain ratio and tensile hold time on low-cycle fatigue of lead-free Sn-3.5Ag-0.5Cu solder Lin CK,Huang CM
    2006 Electromigration-induced UBM consumption and the resulting failure mechanisms in flip-chip solder joints Lin YL,Chang CW,Tsai CM,Lee CW,Kao CR
    2006 Fabrication of periodic nickel silicide nanodot arrays using nanosphere lithography Cheng SL,Lu SW,Li CH,Chang YC,Huang CK,Chen H
    2006 Local melting induced by electromigration in flip-chip solder joints Tsai CM,Lin YL,Tsai JY,Lai YS,Kao CR
    2006 Microstructure evolution of gold-tin eutectic solder on Cu and Ni substrates Tsai JY,Chang CW,Ho CE,Lin YL,Kao CR
    2006 Polymorph farming of Acetaminophen and Sulfathiazole on a chip Lee,Tu; Hung,Shi Ting; Kuo,Chung Shin
    2006 Prevention of electromigration-induced Cu pad dissolution by using a high electromigration-resistance ternary Cu-Ni-Sn layer Hsiao YH,Chuang YC,Liu CY
    2006 Study of electromigration-induced Cu consumption in the flip-chip Sn/Cu solder bumps Liu,C. Y.; Ke,Lin; Chuang,Y. C.; Wang,S. J.
    2006 Study of wetting reaction between eutectic AuSn and Au foil Lai YT,Liu CY
    2006 Thermomigration in eutectic SnPb alloy Chuang YC,Liu CY
    2005 Effect of Ag content and heat treatment on the stress corrosion cracking of Al-4.6Cu-0.3Mg alloy Chang,CH; Lee,SL; Lin,JC; Yeh,MS; Jeng,RR
    2005 Effects of Be and Fe on the mechanical and corrosion behaviors of A357 alloys Yang,CY; Lee,SL; Lee,CK; Lin,JC
    2005 Effects of lead and copper particles on corrosion and wear behaviour of Al-Si matrix composites Chuang,SF; Wu,TF; Lee,SL; Kao,CH; Lin,JC; Lee,ZK
    2005 Electromigration studies of Sn(Cu) and Sn(Ni) alloy stripes Wei,CC; Liu,CY
    2005 High-thermal-stability and low-resistance p-GaN contact for thin-GaN light emitting diodes structure Lin,CL; Wang,SJ; Liu,CY
    2005 In situ observation of the void formation-and-propagation mechanism in solder joints under current-stressing Lin,YH; Hu,YC; Tsai,CM; Kao,CR; Tu,KN

    顯示項目676-700 / 702. (共29頁)
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    每頁顯示[10|25|50]項目

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