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    顯示項目1776-1800 / 2693. (共108頁)
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    日期題名作者
    2004 The mechanism of reduction of cobalt by hydrogen Lin,HY; Chen,YW
    2004 The theoretical study of parallel-plate cool-thermal discharge systems with melt removal and external refluxes Wang,WP; Ho,CD; Lin,HT
    2004 Thermal property of EpOXY/SiO2 hybrid material synthesized by the sol-gel process Weng,WH; Chen,H; Tsai,SP; Wu,JC
    2004 Tin-filled carbon nanotubes as insertion anode materials for lithium-ion batteries Kumar,TP; Ramesh,R; Lin,YY; Fey,GTK
    2004 Vapor-liquid equilibrium measurements for tetraethyl orthosilicate plus ethanol at 24.00 kPa and 53.32 kPa Huang,JF; Lee,YF; Lee,LS
    2004 A simple mechano-thermal coating process for improved lithium battery cathode materials Fey,GTK; Yang,HZ; Kumar,TP; Naik,SP; Chiang,AST; Lee,DC; Lin,JR
    2004 A TEA-starch combustion method for the synthesis of fine-particulate LiMn2O4 Fey,GTK; Cho,YD; Kumar,TP
    2004 Absorbance behavior of polyaniline-poly(styrenesulfonic acid) complexes and tungsten oxide Lin,DS
    2004 An effective Cu-Sn barrier layer for Au bump used in optoelectronic devices Liu,CY; Wang,SJ
    2004 An efficient two-phase reaction of ethyl acetate production in modified ZSM-5 zeolites Wu,KC; Chen,YW
    2004 Bio-degradation of pristane in mixed alkanes by a mixed culture containing Nocardia corynebacterioides Ruaan,RC; Yu,DJ
    2004 Carbon dioxide recovery by vacuum swing adsorption Chou,CT; Chen,CY
    2004 Chain persistency in single-stranded DNA Sain,A; Ha,BY; Tsao,HK; Chen,JZY
    2004 Charge renormalization of charged spheres based on thermodynamic properties Hsin,WL; Wang,TY; Sheng,YJ; Tsao,HK
    2004 Correlation between interfacial reactions and mechanical strengths of Sn(Cu)/Ni(P) solder bumps Wang,SJ; Kao,HJ; Liu,CY
    2004 Cross-interaction of under-bump metallurgy and surface finish in flip-chip solder joints Tsai,CM; Luo,WC; Chang,CW; Shieh,YC; Kao,CR
    2004 Effect of calcination temperature on catalyst reducibility and hydrogenation reactivity in rice husk ash-alumina supported nickel systems Chang,FW; Kuo,MS; Tsay,MT; Hsieh,MC
    2004 Effect of fluoroalkyl substituents on the reactions of alkylchlorosilanes with mold surfaces for nanoimprint lithography Chen,JK; Ko,FH; Hsieh,KF; Chou,CT; Chang,FC
    2004 Effect of pH on the production and molecular weight distribution of exopolysaccharide by Antrodia camphorata in batch cultures Shu,CH; Lung,MY
    2004 Effects of culture pm on the production of bioactive polysaccharides by Agaricus blazei in batch cultures Shu,CH; Lin,KJ; Wen,BJ
    2004 Effects of surfactant micelles on viscosity and conductivity of poly(ethylene glycol) solutions Wang,SC; Wei,TC; Chen,WB; Tsao,HK
    2004 Effects of the gold thickness of the surface finish on the interfacial reactions in flip-chip solder joints Lin,YL; Luo,WC; Lin,YH; Ho,CE; Kao,CR
    2004 Electromigration-induced microstructure evolution in tin studied by synchrotron x-ray microdiffraction Wu,AT; Tu,KN; Lloyd,JR; Tamura,N; Valek,BC; Kao,CR
    2004 Electrostatic attraction between neutral microdroplets by ion fluctuations Sheng,YJ; Tsao,HK
    2004 Enzymatic grafting of carboxyl groups on to chitosan - to confer on chitosan the property of a cationic dye adsorbent Chao,AC; Shyu,SS; Lin,YC; Mi,FL

    顯示項目1776-1800 / 2693. (共108頁)
    << < 67 68 69 70 71 72 73 74 75 76 > >>
    每頁顯示[10|25|50]項目

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