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Items for Author "Ho,CE"
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Showing 17 items.
Collection
Date
Title
Authors
Bitstream
[化學工程與材料工程研究所] 期刊論文
2004
Effects of the gold thickness of the surface finish on the interfacial reactions in flip-chip solder joints
Lin,YL
;
Luo,WC
;
Lin,YH
;
Ho,CE
;
Kao,CR
[化學工程與材料工程研究所] 期刊論文
2003
Chemical reaction in solder joints of microelectronic packages
Ho,CE
;
Lin,YL
;
Tsai,JY
;
Kao,CR
[化學工程與材料工程研究所] 期刊論文
2002
Effect of Cu concentration on the interfacial reactions between Ni and Sn-Cu solders
Chen,WT
;
Ho,CE
;
Kao,CR
[化學工程與材料工程研究所] 期刊論文
2002
Effect of Cu concentration on the reactions between Sn-Ag-Cu solders and Ni
Ho,CE
;
Tsai,RY
;
Lin,YL
;
Kao,CR
[化學工程與材料工程研究所] 期刊論文
2002
Inhibiting the formation of (Au1-xNix)Sn-4 and reducing the consumption of Ni metallization in solder joints
Ho,CE
;
Shiau,LC
;
Kao,CR
[化學工程與材料工程研究所] 期刊論文
2002
Reactions between Sn-Ag-Cu lead-free solders and the Au/Ni surface finish in advanced electronic packages
Shiau,LC
;
Ho,CE
;
Kao,CR
[化學工程與材料工程研究所] 期刊論文
2002
Strong effect of Cu concentration on the reaction between lead-free microelectronic solders and Ni
Ho,CE
;
Lin,YL
;
Kao,CR
[化學工程與材料工程研究所] 期刊論文
2001
Interactions between solder and metallization during long-term aging of advanced microelectronic packages
Ho,CE
;
Chen,WT
;
Kao,CR
[化學工程與材料工程研究所] 期刊論文
2001
Reaction of solder with Ni/Au metallization for electronic packages during reflow soldering
Ho,CE
;
Tsai,SY
;
Kao,CR
[化學工程與材料工程研究所] 期刊論文
2001
Reflow soldering and isothermal solid-state aging of Sn-Ag eutectic solder on Au/Ni surface finish
Liu,CM
;
Ho,CE
;
Chen,WT
;
Kao,CR
[化學工程與材料工程研究所] 期刊論文
2001
Selective interfacial reaction between Ni and eutectic BiSn lead-free solder
Tao,WH
;
Chen,C
;
Ho,CE
;
Chen,WT
;
Kao,CR
[化學工程與材料工程研究所] 期刊論文
2000
Formation and resettlement of (AuxNi1-x)Sn-4 in solder joints of ball-grid-array packages with the Au/Ni surface finish
Ho,CE
;
Zheng,R
;
Luo,GL
;
Lin,AH
;
Kao,CR
[化學工程與材料工程研究所] 期刊論文
2000
Long-term aging study on the solid-state reaction between 58Bi42Sn solder and Ni substrate
Chen,C
;
Ho,CE
;
Lin,AH
;
Luo,GL
;
Kao,CR
[化學工程與材料工程研究所] 期刊論文
2000
Optimizing the wire-bonding parameters for second bonds in ball grid array packages
Ho,CE
;
Chen,C
;
Kao,CR
[化學工程與材料工程研究所] 期刊論文
1999
Phase relation in the titanium-rich region of the Ge-Si-Ti ternary system
Jain,TA
;
Huang,CG
;
Ho,CE
;
Kao,CR
[化學工程與材料工程研究所] 期刊論文
1999
Reaction kinetics of solder-balls with pads in BGA packages during reflow soldering
Ho,CE
;
Chen,YM
;
Kao,CR
[材料科學與工程研究所 ] 期刊論文
2005
Solid-state reactions between Ni and Sn-Ag-Cu solders with different Cu concentrations
Luo,WC
;
Ho,CE
;
Tsai,JY
;
Lin,YL
;
Kao,CR
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