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Uniform dispersion of Pd nanopartic...
The effect of oxygen containing spe...
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Surface Condition Manipulation and ...
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Showing items 76-100 of 118. (5 Page(s) Totally)
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Date
Title
Authors
2007
Ag/Au diffusion wafer bonding for thin-GaN LED fabrication
Chang,C. L.
;
Chuang,Y. C.
;
Liu,C. Y.
2007
Amorphous Si/Au wafer bonding
Chen,P. H.
;
Lin,C. L.
;
Liu,C. Y.
2007
Coupling effect in Pt/Sn/Cu sandwich solder joint structures
Wang,S. J.
;
Liu,C. Y.
2007
Dimorphs of sucrose
Lee,Tu
;
Lin,Yu Sheng
2007
Effects of cross-channel extrusion on the micirostructures and superplasticity of a Zn-22 wt.% Al eutectoid alloy
Chou,Cheng-Yu
;
Lee,Sheng-Long
;
Lin,Jing-Chie
;
Hsu,Ching-Miow
2007
Effects of geometrical characteristics of surface roughness on droplet wetting
Sheng,Yu-Jane
;
Jiang,Shaoyi
;
Tsao,Heng-Kwong
2007
Electroless synthesis of pure nickel metal nanotubes using silicon oxide nanowires as removable templates
Cheng,S. L.
;
Hsiao,W. C.
2007
Fabrication of 2D ordered arrays of cobalt silicide nanodots on (0 0 1)Si substrates (vol 300, pg 473, 2007)
Cheng,S. L.
;
Lu,S. W.
;
Wong,S. L.
;
Chang,C. C.
;
Chen,H.
2007
Fabrication of 2D ordered arrays of cobalt silicide nanodots on (001)Si substrates
Cheng,S. L.
;
Lu,S. W.
;
Wong,S. L.
;
Chang,C. C.
;
Chen,H.
2007
Fabrication of a nanoscale single-crystalline silicon thin film on insulator
Lee,T.-H.
;
Huang,C.-H.
;
Yang,Y.-Y.
;
Li,P.-W.
;
Suryasindhu,T.
;
Lee,S.
2007
Fabrication of Mg-based intermetallic compounds by liquid electromigration
Li,C. H.
;
Chuang,Y. C.
;
Liu,C. Y.
2007
From superhydrophobic to superhydrophilic surfaces tuned by surfactant solutions
Chang,Feng-Ming
;
Sheng,Yu-Jane
;
Chen,Hui
;
Tsao,Heng-Kwong
2007
High thermally stable Ni/Ag(Al) alloy contacts on p-GaN
Chou,C. H.
;
Lin,C. L.
;
Chuang,Y. C.
;
Bor,H. Y.
;
Liu,C. Y.
2007
Light emission of sputtered particles induced by ion bombardment on water-enriched molecular ices
Lee,Chin Shuang
;
Ip,Wing
;
Liu,S. H.
;
Hsu,G. Y.
;
Lee,Shyong
2007
Light enhancement by the formation of an Al oxide honeycomb nanostructure on the n-GaN surface of thin-GaN light-emitting diodes
Lin,C. L.
;
Chen,P. H.
;
Chan,Chia-Hua
;
Lee,C. C.
;
Chen,Chii-Chang
;
Chang,Jeng-Yang
;
Liu,C. Y.
2007
Mass production of Mg2Ni alloy bulk by isothermal evaporation casting process
Hsu,Che-Wei
;
Lee,Sheng-Long
;
Jeng,Rong-Ruey
;
Lin,Jing-Chie
2007
Sublimation point depression of tris(8-hydroxyquinoline)aluminum(III) (Alq3) by crystal engineering
Lee,Tu
;
Lin,Ming Shiou
2007
The effect of thermomigration on phase coarsening in a eutectic SnPb alloy
Chuang,Y. C.
;
Liu,C. Y.
2006
Asymmetrical solder microstructure in Ni/Sn/Cu solder joint
Wang,S. J.
;
Liu,C. Y.
2006
Creep properties of Sn-3.5Ag-0.5Cu lead-free solder under step-loading
Lin,Chih-Kuang
;
Teng,Hsuan-Yu
2006
Cross-interaction between Au and Cu in Au/Sn/Cu ternary diffusion couples
Chang CW,Lee QP,Ho CE,Kao CR
2006
Current density dependence of electromigration-induced flip-chip Cu pad consumption
Lin,C. T.
;
Chuang,Y. C.
;
Wang,S. J.
;
Liu,C. Y.
2006
Effect of Fe and Si on properties of squeezed aluminium metal matrix Nd-Fe-B composite magnets
Chuang,S. -F.
;
Lee,S. -L.
;
Lin,F. -J.
;
Lin,J. -C.
2006
Effect of heat treatments on the tensile strength and SCC-resistance of AA7050 in an alkaline saline solution
Lin,Jing-Chie
;
Liao,Hsueh-Lung
;
Jehng,Wern-Dare
;
Chang,Chih-Horng
;
Lee,Sheng-Long
2006
Effects of limited Cu supply on soldering reactions between SnAgCu and Ni
Ho CE,Lin YW,Yang SC,Kao CR,Jiang DS
Showing items 76-100 of 118. (5 Page(s) Totally)
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