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日期	題名	作者
2005	Effect of Ag content and heat treatment on the stress corrosion cracking of Al-4.6Cu-0.3Mg alloy	Chang,CH; Lee,SL; Lin,JC; Yeh,MS; Jeng,RR
2005	Effects of Be and Fe on the mechanical and corrosion behaviors of A357 alloys	Yang,CY; Lee,SL; Lee,CK; Lin,JC
2005	Effects of lead and copper particles on corrosion and wear behaviour of Al-Si matrix composites	Chuang,SF; Wu,TF; Lee,SL; Kao,CH; Lin,JC; Lee,ZK
2005	Electromigration studies of Sn(Cu) and Sn(Ni) alloy stripes	Wei,CC; Liu,CY
2005	High-thermal-stability and low-resistance p-GaN contact for thin-GaN light emitting diodes structure	Lin,CL; Wang,SJ; Liu,CY
2005	In situ observation of the void formation-and-propagation mechanism in solder joints under current-stressing	Lin,YH; Hu,YC; Tsai,CM; Kao,CR; Tu,KN
2005	Solid-state reactions between Ni and Sn-Ag-Cu solders with different Cu concentrations	Luo,WC; Ho,CE; Tsai,JY; Lin,YL; Kao,CR
2005	The effect of silver content on the precipitation of the Al-4.6Cu-0.3Mg alloy	Chang,CH; Lee,SL; Lin,JC; Jeng,RR
2006	Asymmetrical solder microstructure in Ni/Sn/Cu solder joint	Wang,S. J.; Liu,C. Y.
2006	Creep properties of Sn-3.5Ag-0.5Cu lead-free solder under step-loading	Lin,Chih-Kuang; Teng,Hsuan-Yu
2006	Cross-interaction between Au and Cu in Au/Sn/Cu ternary diffusion couples	Chang CW,Lee QP,Ho CE,Kao CR
2006	Current density dependence of electromigration-induced flip-chip Cu pad consumption	Lin,C. T.; Chuang,Y. C.; Wang,S. J.; Liu,C. Y.
2006	Effect of Fe and Si on properties of squeezed aluminium metal matrix Nd-Fe-B composite magnets	Chuang,S. -F.; Lee,S. -L.; Lin,F. -J.; Lin,J. -C.
2006	Effect of heat treatments on the tensile strength and SCC-resistance of AA7050 in an alkaline saline solution	Lin,Jing-Chie; Liao,Hsueh-Lung; Jehng,Wern-Dare; Chang,Chih-Horng; Lee,Sheng-Long
2006	Effects of limited Cu supply on soldering reactions between SnAgCu and Ni	Ho CE,Lin YW,Yang SC,Kao CR,Jiang DS
2006	Effects of strain ratio and tensile hold time on low-cycle fatigue of lead-free Sn-3.5Ag-0.5Cu solder	Lin CK,Huang CM
2006	Electromigration-induced UBM consumption and the resulting failure mechanisms in flip-chip solder joints	Lin YL,Chang CW,Tsai CM,Lee CW,Kao CR
2006	Fabrication of periodic nickel silicide nanodot arrays using nanosphere lithography	Cheng SL,Lu SW,Li CH,Chang YC,Huang CK,Chen H
2006	Local melting induced by electromigration in flip-chip solder joints	Tsai CM,Lin YL,Tsai JY,Lai YS,Kao CR
2006	Microstructure evolution of gold-tin eutectic solder on Cu and Ni substrates	Tsai JY,Chang CW,Ho CE,Lin YL,Kao CR
2006	Polymorph farming of Acetaminophen and Sulfathiazole on a chip	Lee,Tu; Hung,Shi Ting; Kuo,Chung Shin
2006	Prevention of electromigration-induced Cu pad dissolution by using a high electromigration-resistance ternary Cu-Ni-Sn layer	Hsiao YH,Chuang YC,Liu CY
2006	Study of electromigration-induced Cu consumption in the flip-chip Sn/Cu solder bumps	Liu,C. Y.; Ke,Lin; Chuang,Y. C.; Wang,S. J.
2006	Study of wetting reaction between eutectic AuSn and Au foil	Lai YT,Liu CY
2006	Thermomigration in eutectic SnPb alloy	Chuang YC,Liu CY

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