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日期	題名	作者
2007	Ag/Au diffusion wafer bonding for thin-GaN LED fabrication	Chang,C. L.; Chuang,Y. C.; Liu,C. Y.
2007	Amorphous Si/Au wafer bonding	Chen,P. H.; Lin,C. L.; Liu,C. Y.
2007	Coupling effect in Pt/Sn/Cu sandwich solder joint structures	Wang,S. J.; Liu,C. Y.
2007	Dimorphs of sucrose	Lee,Tu; Lin,Yu Sheng
2007	Effects of cross-channel extrusion on the micirostructures and superplasticity of a Zn-22 wt.% Al eutectoid alloy	Chou,Cheng-Yu; Lee,Sheng-Long; Lin,Jing-Chie; Hsu,Ching-Miow
2007	Effects of geometrical characteristics of surface roughness on droplet wetting	Sheng,Yu-Jane; Jiang,Shaoyi; Tsao,Heng-Kwong
2007	Electroless synthesis of pure nickel metal nanotubes using silicon oxide nanowires as removable templates	Cheng,S. L.; Hsiao,W. C.
2007	Fabrication of 2D ordered arrays of cobalt silicide nanodots on (0 0 1)Si substrates (vol 300, pg 473, 2007)	Cheng,S. L.; Lu,S. W.; Wong,S. L.; Chang,C. C.; Chen,H.
2007	Fabrication of 2D ordered arrays of cobalt silicide nanodots on (001)Si substrates	Cheng,S. L.; Lu,S. W.; Wong,S. L.; Chang,C. C.; Chen,H.
2007	Fabrication of a nanoscale single-crystalline silicon thin film on insulator	Lee,T.-H.; Huang,C.-H.; Yang,Y.-Y.; Li,P.-W.; Suryasindhu,T.; Lee,S.
2007	Fabrication of Mg-based intermetallic compounds by liquid electromigration	Li,C. H.; Chuang,Y. C.; Liu,C. Y.
2007	From superhydrophobic to superhydrophilic surfaces tuned by surfactant solutions	Chang,Feng-Ming; Sheng,Yu-Jane; Chen,Hui; Tsao,Heng-Kwong
2007	High thermally stable Ni/Ag(Al) alloy contacts on p-GaN	Chou,C. H.; Lin,C. L.; Chuang,Y. C.; Bor,H. Y.; Liu,C. Y.
2007	Light emission of sputtered particles induced by ion bombardment on water-enriched molecular ices	Lee,Chin Shuang; Ip,Wing; Liu,S. H.; Hsu,G. Y.; Lee,Shyong
2007	Light enhancement by the formation of an Al oxide honeycomb nanostructure on the n-GaN surface of thin-GaN light-emitting diodes	Lin,C. L.; Chen,P. H.; Chan,Chia-Hua; Lee,C. C.; Chen,Chii-Chang; Chang,Jeng-Yang; Liu,C. Y.
2007	Mass production of Mg2Ni alloy bulk by isothermal evaporation casting process	Hsu,Che-Wei; Lee,Sheng-Long; Jeng,Rong-Ruey; Lin,Jing-Chie
2007	Sublimation point depression of tris(8-hydroxyquinoline)aluminum(III) (Alq3) by crystal engineering	Lee,Tu; Lin,Ming Shiou
2007	The effect of thermomigration on phase coarsening in a eutectic SnPb alloy	Chuang,Y. C.; Liu,C. Y.
2006	Asymmetrical solder microstructure in Ni/Sn/Cu solder joint	Wang,S. J.; Liu,C. Y.
2006	Creep properties of Sn-3.5Ag-0.5Cu lead-free solder under step-loading	Lin,Chih-Kuang; Teng,Hsuan-Yu
2006	Cross-interaction between Au and Cu in Au/Sn/Cu ternary diffusion couples	Chang CW,Lee QP,Ho CE,Kao CR
2006	Current density dependence of electromigration-induced flip-chip Cu pad consumption	Lin,C. T.; Chuang,Y. C.; Wang,S. J.; Liu,C. Y.
2006	Effect of Fe and Si on properties of squeezed aluminium metal matrix Nd-Fe-B composite magnets	Chuang,S. -F.; Lee,S. -L.; Lin,F. -J.; Lin,J. -C.
2006	Effect of heat treatments on the tensile strength and SCC-resistance of AA7050 in an alkaline saline solution	Lin,Jing-Chie; Liao,Hsueh-Lung; Jehng,Wern-Dare; Chang,Chih-Horng; Lee,Sheng-Long
2006	Effects of limited Cu supply on soldering reactions between SnAgCu and Ni	Ho CE,Lin YW,Yang SC,Kao CR,Jiang DS

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