鄰近類別 研究計畫 [184/184] 博碩士論文 [400/400] 類別統計 近3年內發表的文件: 0(0.00%) 含全文筆數: 118(100.00%) 文件下載次數統計 下載大於0次: 118(100.00%) 下載大於100次: 118(100.00%) 檔案下載總次數: 83982(21.63%) 最後更新時間: 2025-12-23 20:42 上傳排行 資料載入中..... 下載排行 資料載入中..... 最近上傳 Uniform dispersion of Pd nanopartic... The effect of oxygen containing spe... Synergistic effect of Co alloying a... Surface Condition Manipulation and ... Promotion of Pt-Ru/C catalysts driv... Preparation of Highly Adhesive and ... Influence of Mg(3)AlNi(2) content o... Improvement of oxygen reduction rea... Improved pseudocapacitive performan... Hydrogen desorption behavior of van...

跳至: (選擇年份) 2025 2024 2023 2022 2021 2020 2019 2018 2017 2016 2015 2014 2013 2012 2011 2010 2009 2008 2007 2006 2005 2004 2003 2002 2001 2000 1999 1998 1997 1996 1995 1994 1993 1992 1991 1990 1985 1980 1975 1970 1960 1950 (選擇月份) January February March April May June July August September October November December 或輸入年份:

由新到舊排序 由最舊的開始

顯示項目91-100 / 118. (共12頁) << < 3 4 5 6 7 8 9 10 11 12 > >> 每頁顯示[10|25|50]項目

日期	題名	作者
2007	Mass production of Mg2Ni alloy bulk by isothermal evaporation casting process	Hsu,Che-Wei; Lee,Sheng-Long; Jeng,Rong-Ruey; Lin,Jing-Chie
2007	Sublimation point depression of tris(8-hydroxyquinoline)aluminum(III) (Alq3) by crystal engineering	Lee,Tu; Lin,Ming Shiou
2007	The effect of thermomigration on phase coarsening in a eutectic SnPb alloy	Chuang,Y. C.; Liu,C. Y.
2006	Asymmetrical solder microstructure in Ni/Sn/Cu solder joint	Wang,S. J.; Liu,C. Y.
2006	Creep properties of Sn-3.5Ag-0.5Cu lead-free solder under step-loading	Lin,Chih-Kuang; Teng,Hsuan-Yu
2006	Cross-interaction between Au and Cu in Au/Sn/Cu ternary diffusion couples	Chang CW,Lee QP,Ho CE,Kao CR
2006	Current density dependence of electromigration-induced flip-chip Cu pad consumption	Lin,C. T.; Chuang,Y. C.; Wang,S. J.; Liu,C. Y.
2006	Effect of Fe and Si on properties of squeezed aluminium metal matrix Nd-Fe-B composite magnets	Chuang,S. -F.; Lee,S. -L.; Lin,F. -J.; Lin,J. -C.
2006	Effect of heat treatments on the tensile strength and SCC-resistance of AA7050 in an alkaline saline solution	Lin,Jing-Chie; Liao,Hsueh-Lung; Jehng,Wern-Dare; Chang,Chih-Horng; Lee,Sheng-Long
2006	Effects of limited Cu supply on soldering reactions between SnAgCu and Ni	Ho CE,Lin YW,Yang SC,Kao CR,Jiang DS

顯示項目91-100 / 118. (共12頁) << < 3 4 5 6 7 8 9 10 11 12 > >> 每頁顯示[10|25|50]項目