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日期	題名	作者
2006	Effects of strain ratio and tensile hold time on low-cycle fatigue of lead-free Sn-3.5Ag-0.5Cu solder	Lin CK,Huang CM
2006	Electromigration-induced UBM consumption and the resulting failure mechanisms in flip-chip solder joints	Lin YL,Chang CW,Tsai CM,Lee CW,Kao CR
2006	Fabrication of periodic nickel silicide nanodot arrays using nanosphere lithography	Cheng SL,Lu SW,Li CH,Chang YC,Huang CK,Chen H
2006	Local melting induced by electromigration in flip-chip solder joints	Tsai CM,Lin YL,Tsai JY,Lai YS,Kao CR
2006	Microstructure evolution of gold-tin eutectic solder on Cu and Ni substrates	Tsai JY,Chang CW,Ho CE,Lin YL,Kao CR
2006	Polymorph farming of Acetaminophen and Sulfathiazole on a chip	Lee,Tu; Hung,Shi Ting; Kuo,Chung Shin
2006	Prevention of electromigration-induced Cu pad dissolution by using a high electromigration-resistance ternary Cu-Ni-Sn layer	Hsiao YH,Chuang YC,Liu CY
2006	Study of electromigration-induced Cu consumption in the flip-chip Sn/Cu solder bumps	Liu,C. Y.; Ke,Lin; Chuang,Y. C.; Wang,S. J.
2006	Study of wetting reaction between eutectic AuSn and Au foil	Lai YT,Liu CY
2006	Thermomigration in eutectic SnPb alloy	Chuang YC,Liu CY

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