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類別	日期	題名	作者
[化學工程與材料工程研究所] 期刊論文	2009	Corrosion behavior of Al, Sc-co-doped ZnO thin films in 3.5% NaCl solution	Lin,JC; Peng,KC; Peng,IG; Lee,SL
[化學工程與材料工程研究所] 期刊論文	2009	Effect of pre-immersion on the SCC of heat-treated AA7050 in an alkaline 3.5%NaCl	Liao,HL; Lin,JC; Lee,SL
[化學工程與材料工程研究所] 期刊論文	2009	Influence of hot-pressing temperature on the performance of PEMFC and catalytic activity	Lin,JC; Lai,CM; Ting,FP; Chyou,SD; Hsueh,KL
[化學工程與材料工程研究所] 期刊論文	2009	On the structure and characterization of Al, Sc-co-doped ZnO-films varying with 0-2.37 wt.% Sc contents	Lin,JC; Peng,KC; Yeh,TY; Lee,SL
[化學研究所] 期刊論文	1997	Hydrogen chemisorption and thermal desorption on the diamond C(111) surface	Su,C; Song,KJ; Wang,YL; Lu,HL; Chuang,TJ; Lin,JC
[光機電工程研究所 ] 期刊論文	2005	Fabrication of micrometer Ni columns by continuous and intermittent microanode guided electroplating	Lin,JC; Jang,SB; Lee,DL; Chen,CC; Yeh,PC; Chang,TK; Yang,JH
[材料科學與工程研究所 ] 期刊論文	2011	Corrosion characteristics of nickel, copper, and stainless steel in a Lewis neutral chloroalurninate ionic liquid	Lin,PC; Sun,IW; Chang,JK; Su,CJ; Lin,JC
[材料科學與工程研究所 ] 期刊論文	2011	Development of new type Ni-Mg texture-like structure hydrogen absorber	Hsu,CW; Lee,SL; Hsu,FK; Lin,JC
[材料科學與工程研究所 ] 期刊論文	2011	Influence of Mg(3)AlNi(2) content on the cycling stability of Mg(2)Ni-Mg(3)AlNi(2) hydrogen storage alloy electrodes	Lee,SL; Hsu,FK; Chen,WC; Lin,CK; Lin,JC
[材料科學與工程研究所 ] 期刊論文	2010	Localized electrochemical deposition of micrometer copper columns by pulse plating	Lin,JC; Chang,TK; Yang,JH; Chen,YS; Chuang,CL
[材料科學與工程研究所 ] 期刊論文	2005	Effect of Ag content and heat treatment on the stress corrosion cracking of Al-4.6Cu-0.3Mg alloy	Chang,CH; Lee,SL; Lin,JC; Yeh,MS; Jeng,RR
[材料科學與工程研究所 ] 期刊論文	2005	Effects of Be and Fe on the mechanical and corrosion behaviors of A357 alloys	Yang,CY; Lee,SL; Lee,CK; Lin,JC
[材料科學與工程研究所 ] 期刊論文	2005	Effects of lead and copper particles on corrosion and wear behaviour of Al-Si matrix composites	Chuang,SF; Wu,TF; Lee,SL; Kao,CH; Lin,JC; Lee,ZK
[材料科學與工程研究所 ] 期刊論文	2005	The effect of silver content on the precipitation of the Al-4.6Cu-0.3Mg alloy	Chang,CH; Lee,SL; Lin,JC; Jeng,RR
[通訊工程研究所] 期刊論文	2009	Channel estimation assisted by postfixed pseudo-noise sequences padded with zero samples for mobile orthogonal-frequency-division-multiplexing communications	Lin,JC
[通訊工程研究所] 期刊論文	2009	Least-squares channel estimation assisted by self-interference cancellation for mobile pseudo-random-postfix orthogonal-frequency-division multiplexing applications	Lin,JC
[通訊工程研究所] 期刊論文	2007	A frequency offset estimation technique based on CCK for a WLAN receiver design	Hsu,HY; Lin,JC
[通訊工程研究所] 期刊論文	2007	A frequency offset estimation technique based on frequency error characterization for OFDM communications on multipath fading channels	Lin,JC
[資訊工程研究所] 期刊論文	2008	Ratio-based time synchronization protocol in wireless sensor networks	Sheu,JP; Hu,WK; Lin,JC
[資訊工程研究所] 期刊論文	2000	A new LDA-based face recognition system which can solve the small sample size problem	Chen,LF; Liao,HYM; Ko,MT; Lin,JC; Yu,GJ
[資訊工程學系] 期刊論文	2010	Distributed Localization Scheme for Mobile Sensor Networks	Sheu,JP; Hu,WK; Lin,JC
[機械工程研究所] 期刊論文	2009	Effect of trace La addition on the microstructures and mechanical properties of A356 (Al-7Si-0.35Mg) aluminum alloys	Tsai,YC; Chou,CY; Lee,SL; Lin,CK; Lin,JC; Lim,SW
[機械工程研究所] 期刊論文	2009	Fabrication of a micrometer Ni-Cu alloy column coupled with a Cu micro-column for thermal measurement	Lin,JC; Chang,TK; Yang,JH; Jeng,JH; Lee,DL; Jiang,SB
[機械工程研究所] 期刊論文	2009	Localized Ni deposition improved by saccharin sodium in the intermittent MAGE process	Yang,JH; Lin,JC; Chang,TK; You,XB; Jiang,SB
[機械工程研究所] 期刊論文	2009	On the characterization of Al-0.11 wt.%Sc alloy thin film	Liao,HL; Lin,JC; Chen,YS; Chuang,CL; Lee,SL
[機械工程研究所] 期刊論文	2009	On the oxygen reduction reaction catalyzed by Ti-Cu binary films in 0.5 M sulfuric acid solution	Lin,JC; Chuang,CL; Lai,CM; Chu,HC; Chen,YS
[機械工程研究所] 期刊論文	2009	On the structure of micrometer copper features fabricated by intermittent micro-anode guided electroplating	Lin,JC; Yang,JH; Chang,TK; Jiang,SB
[機械工程研究所] 期刊論文	2005	Concentration effect of HF on energy band diagram for n-Si(100)/HF photoelectrochemical etching system	Jehng,WD; Lin,JC; Lee,SL
[機械工程研究所] 期刊論文	2005	Effects of tungsten carbide and cobalt particles on corrosion and wear behaviour of copper matrix composite	Wu,TF; Lee,SL; Chen,MH; Li,ZG; Lin,JC
[機械工程研究所] 期刊論文	2005	Energy band diagrams for the photo-electrochemical dissolution of n-Si(100) in HF	Jehng,WD; Lin,JC; Lai,CM; Lee,SL
[機械工程研究所] 期刊論文	2005	Separation of gallium and arsenic in wafer grinding extraction solution using a supported liquid membrane that contains PC88A as a carrier	Tsai,CY; Chen,YF; Chen,WC; Yang,FR; Chen,JH; Lin,JC
[機械工程研究所] 期刊論文	2004	Effect of beryllium and non-equilibrium heat treatment on mechanical properties of B319.0 alloy with 1 center dot 0%Fe	Wang,PS; Lee,SL; Yang,CY; Lin,JC
[機械工程研究所] 期刊論文	2004	Effects of graphite on wear and corrosion behaviour of SiCp-reinforced copper matrix composites formed by hot pressing	Wu,TF; Qiu,ZW; Lee,SL; Lee,ZG; Lin,JC
[機械工程研究所] 期刊論文	2003	Electroplating of copper onto a preanodized 7005Al/Al2O3(P) metal matrix composite	Lin,JC; Jehng,WD; Lee,SL
[機械工程研究所] 期刊論文	2003	Processing and properties of high volume fraction aluminium/silicon composites	Chien,CW; Lee,SL; Lin,JC
[機械工程研究所] 期刊論文	2002	Effects of Si-p size and volume fraction on properties of Al/Si-p composites	Chien,CW; Lee,SL; Lin,JC; Jahn,MT
[機械工程研究所] 期刊論文	2002	Solid-liquid interdiffusion bonding between In-coated silver thick films	Lin,JC; Huang,LW; Jang,GY; Lee,SL
[機械工程研究所] 期刊論文	2000	Effects of Fe content on microstructure and mechanical properties of A206 alloy	Tseng,CJ; Lee,SL; Wu,TF; Lin,JC
[機械工程研究所] 期刊論文	2000	Effects of solution temperature on mechanical properties of 319.0 aluminum casting alloys containing trace beryllium	Wang,PS; Lee,SL; Lin,JC; Jahn,MT
[機械工程研究所] 期刊論文	1999	Corrosion inhibition of steel by thiourea and cations under incomplete cathodic protection in a 3.5% NaCl solution and seawater	Lin,JC; Chang,SL; Lee,SL
[機械工程研究所] 期刊論文	1999	Effects of SiCp reinforcement by electroless copper plating on properties of Cu/SiCp composites	Lee,YF; Lee,SL; Chuang,CL; Lin,JC
[機械工程研究所] 期刊論文	1999	Mechanical properties of Al-11%Si casting alloys containing trace Be and Sr	Yie,SN; Lee,SL; Lin,YH; Lin,JC
[機械工程研究所] 期刊論文	1999	The properties of Zn-Ni electrodeposition on aluminium alloys	Wang,PS; Liang,MR; Lee,SL; Lin,JC
[機械工程研究所] 期刊論文	1999	Wear and corrosion behaviors of SiCp reinforced copper matrix composite formed by hot pressing	Lee,YF; Lee,SL; Lin,JC
[機械工程研究所] 期刊論文	1998	Effect of pre-aging on precipitation hardening in Al-Si-Mg alloys	Lee,SL; Tan,YH; Yie,SN; Lin,JC
[機械工程研究所] 期刊論文	1998	Effects of Be addition on microstructures and mechanical properties of B319.0 alloys	Wamg,PS; Liauh,YJ; Lee,SL; Lin,JC
[機械工程研究所] 期刊論文	1997	Resistance to silver electrolytic migration for thick-film conductors prepared from mixed and alloyed powders of Ag-15Pd and Ag-30Pd	Lin,JC; Chuang,JY
[機械工程研究所] 期刊論文	1996	Assessment of polyester and polyvinylester coatings in a simulated FGD scrubbing liquid with EIS	Lin,JC; Lue,LY; Chyou,SD; Horng,HN
[機械工程研究所] 期刊論文	1996	Effect of surface properties of silver powder on the sintering of its thick-film conductor	Lin,JC; Wang,CY
[機械工程研究所] 期刊論文	1996	Effects of surfactant treatment of silver powder on the rheology of its thick-film paste	Lin,JC; Wang,CY
[機械工程研究所] 期刊論文	1996	On the resistance of silver migration in Ag-Pd conductive thick films under humid environment and applied dc field	Lin,JC; Chan,JY
[機械工程研究所] 期刊論文	1996	Selective dissolution of the cobalt binder from scraps of cemented tungsten carbide in acids containing additives	Lin,JC; Lin,JY; Jou,SP
[機械工程研究所] 期刊論文	1996	Synthesis and characterization of phosphorus complexes of meso-tetraphenylporphyrin (tpp), and X-ray crystal structure of [P(tpp)(OCH(CH3)(2))(2)](+)Cl-	Cheng,PC; Liu,IC; Hong,TN; Chen,JH; Wang,SS; Wang,SL; Lin,JC
[機械工程研究所] 期刊論文	1995	ON THE SINTERING OF MIXED AND ALLOYED SILVER-PALLADIUM POWDERS FROM CHEMICAL COPRECIPITATION	LIN,JC; WU,W
[機械工程研究所] 期刊論文	1994	EFFECT OF CHROMATE ION ON ZINC ELECTROWINNING FROM ACID SULFATE ELECTROLYTE	LIN,JC; TSAI,SL
[機械工程研究所] 期刊論文	1994	ELECTROCHEMICAL STRIPPING OF GOLD FROM AU-NI-CU ELECTRONIC CONNECTOR SCRAP IN AN AQUEOUS-SOLUTION OF THIOUREA	LIN,JC; HUARNG,JJ
[機械工程研究所] 期刊論文	1994	SYNTHESIS, CHARACTERIZATION AND DYNAMICAL NMR-STUDIES OF MESO-TETRA (4-PYRIDYL)PORPHYRINATOTHALLIUM(III) ACETATE - TL(TPYP)(OAC)	FUH,JJ; TANG,SS; LIN,YH; CHEN,JH; LIU,TS; WANG,SS; LIN,JC
[機械工程學系] 期刊論文	2011	Effect of Solvent on the Morphology of Nickel Localized Electrochemical Deposition	Chen,YS; Lin,JC; Lin,ZH; Li,C; Chang,JK
[機械工程學系] 期刊論文	2011	Enhancement of ECDM efficiency and accuracy by spherical tool electrode	Yang,CK; Wu,KL; Hung,JC; Lee,SM; Lin,JC; Yan,BH
[機械工程學系] 期刊論文	2011	Mechanical Properties of Copper Micrometer Pillars Fabricated by Intermittent MAGE Process	Lin,JC; Chen,YS; Huang,CF; Yang,JH; Chang,TK; Wu,CL; Hwang,YR; Chen,TC
[機械工程學系] 期刊論文	2010	Effect of annealing on morphology, optical reflectivity, and stress state of Al-(0.19-0.53) wt.% Sc thin films prepared by magnetron sputtering	Lin,JC; Liao,HL; Jehng,WD; Tseng,CA; Shen,JJ; Lee,SL
[機械工程學系] 期刊論文	2010	Effect of Spinning Deformation Processing on the Wear and Corrosion Properties of Al-7Si-0.3Mg Alloys	Cheng,YC; Lin,CK; Tan,AH; Lin,JC; Lee,SL
[機械工程學系] 期刊論文	2010	Effects of Cu content on microstructure and mechanical properties of Al-14.5Si-0.5Mg alloy	Wu,CT; Lee,SL; Hsieh,MH; Lin,JC
[機械工程學系] 期刊論文	2010	Effects of Mg Content on Microstructure and Mechanical Properties of Al-14.5Si-4.5Cu Alloy	Wu,CT; Lee,SL; Hsieh,MH; Lin,JC
[機械工程學系] 期刊論文	2010	Study on Injection Molding Parameters for Thin-Shell Plastic Parts Using a Neural Network-Based Approach	Lin,JC; Yang,YK; Hsiao,YH; Jeng,MC
[機械工程學系] 期刊論文	2010	The Development of a Real-Time Image Guided Micro Electroplating System	Chen,TC; Hwang,YR; Lin,JC; Ciou,YJ

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