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类别	日期	题名	作者
[化學工程與材料工程研究所] 期刊論文	2009	Dewetting Retardation on Ag/Cu Coated Light Emitting Diode Lead Frames During the Solder Immersion Process	Huang,KC; Shieu,FS; Hsiao,YH; Liu,CY
[化學工程與材料工程研究所] 期刊論文	2009	Electromigration-Induced Failure of Ni/Cu Bilayer Bond Pads Joined with Sn(Cu) Solders	Hsiao,YH; Tseng,HW; Liu,CY
[化學工程與材料工程研究所] 期刊論文	2009	Surface oxidation of molten Sn(Ag, Ni, In, Cu) alloys	Lee,YY; Tseng,HW; Hsiao,YH; Liu,CY
[化學工程與材料工程學系 ] 期刊論文	2011	Abnormal Cu(3)Sn Growth and Kirkendall Formation Between Sn and (111) and (220) Preferred-Orientation Cu Substrates	Huang,TS; Tseng,HW; Hsiao,YH; Cheng,CH; Lu,CT; Liu,CY
[化學工程與材料工程學系 ] 期刊論文	2010	Electromigration-induced failures at Cu/Sn/Cu flip-chip joint interfaces	Tseng,HW; Lu,CT; Hsiao,YH; Liao,PL; Chuang,YC; Chung,TY; Liu,CY
[化學工程與材料工程學系 ] 期刊論文	2010	Growth Mechanism of a Ternary (Cu,Ni)(6)Sn(5) Compound at the Sn(Cu)/Ni(P) Interface	Huang,TS; Tseng,HW; Lu,CT; Hsiao,YH; Chuang,YC; Liu,CY
[機械工程學系] 期刊論文	2010	Study on Injection Molding Parameters for Thin-Shell Plastic Parts Using a Neural Network-Based Approach	Lin,JC; Yang,YK; Hsiao,YH; Jeng,MC