English  |  正體中文  |  简体中文  |  Items with full text/Total items : 66984/66984 (100%)
Visitors : 22628635      Online Users : 434
RC Version 7.0 © Powered By DSPACE, MIT. Enhanced by NTU Library IR team.
Scope Tips:
  • please add "double quotation mark" for query phrases to get precise results
  • please goto advance search for comprehansive author search
  • Adv. Search
    HomeLoginUploadHelpAboutAdminister Goto mobile version

    Category

    Loading community tree, please wait....

    Year

    Loading year class tree, please wait....

    Items for Author "Tseng,HW" 

    Return to Browse by Author

    Showing 12 items.

    Collection Date Title Authors Bitstream
    [化學工程與材料工程學系 ] 期刊論文 2011 Abnormal Cu(3)Sn Growth and Kirkendall Formation Between Sn and (111) and (220) Preferred-Orientation Cu Substrates Huang,TS; Tseng,HW; Hsiao,YH; Cheng,CH; Lu,CT; Liu,CY
    [化學工程與材料工程學系 ] 期刊論文 2010 Electromigration-induced failures at Cu/Sn/Cu flip-chip joint interfaces Tseng,HW; Lu,CT; Hsiao,YH; Liao,PL; Chuang,YC; Chung,TY; Liu,CY
    [化學工程與材料工程學系 ] 期刊論文 2010 Growth Mechanism of a Ternary (Cu,Ni)(6)Sn(5) Compound at the Sn(Cu)/Ni(P) Interface Huang,TS; Tseng,HW; Lu,CT; Hsiao,YH; Chuang,YC; Liu,CY
    [化學工程與材料工程學系 ] 期刊論文 2010 Retardation of electromigration-induced Ni(P) consumption by an electroless Pd insertion layer Lu,CT; Tseng,HW; Chang,CH; Huang,TS; Liu,CY
    [化學工程與材料工程學系 ] 期刊論文 2010 Study of Interfacial Reactions Between Sn(Cu) Solders and Ni-Co Alloy Layers Huang,KC; Shieu,FS; Huang,TS; Lu,CT; Chen,CW; Tseng,HW; Cheng,SL; Liu,CY
    [化學工程與材料工程學系 ] 期刊論文 2010 Variation of Mechanical Property and Microstructure across Sn Solder Joint in Cu/Sn/Ni Structure Liu,CY; Tseng,HW; Song,JM
    [化學工程與材料工程研究所] 期刊論文 2009 Ag Electromigration Against Electron Flow in Sn5Ag/Cu Solder Bump Tseng,HW; Yeh,YT; Lin,KY; Liu,CY
    [化學工程與材料工程研究所] 期刊論文 2009 Cross-Interaction Between Au/Sn and Cu/Sn Interfacial Reactions Yen,YW; Tseng,HW; Zeng,K; Wang,SJ; Liu,CY
    [化學工程與材料工程研究所] 期刊論文 2009 Electromigration-Induced Failure of Ni/Cu Bilayer Bond Pads Joined with Sn(Cu) Solders Hsiao,YH; Tseng,HW; Liu,CY
    [化學工程與材料工程研究所] 期刊論文 2009 Surface oxidation of molten Sn(Ag, Ni, In, Cu) alloys Lee,YY; Tseng,HW; Hsiao,YH; Liu,CY
    [地球物理研究所] 期刊論文 1992 TOPOGRAPHIC RESPONSES IN MAGNETOMETRIC RESISTIVITY MODELING YANG,CH; TSENG,HW
    [通訊工程學系] 期刊論文 2011 Rotational Listening Strategy for IEEE 802.15.4 Wireless Body Networks Tseng,HW; Sheu,ST; Shih,YY

    ::: Copyright National Central University. | 國立中央大學圖書館版權所有 | 收藏本站 | 設為首頁 | 最佳瀏覽畫面: 1024*768 | 建站日期:8-24-2009 :::
    DSpace Software Copyright © 2002-2004  MIT &  Hewlett-Packard  /   Enhanced by   NTU Library IR team Copyright ©   - Feedback  - 隱私權政策聲明