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    Items for Author "Tseng,HW" 

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    Showing 12 items.

    Collection Date Title Authors Bitstream
    [化學工程與材料工程學系 ] 期刊論文 2011 Abnormal Cu(3)Sn Growth and Kirkendall Formation Between Sn and (111) and (220) Preferred-Orientation Cu Substrates Huang,TS; Tseng,HW; Hsiao,YH; Cheng,CH; Lu,CT; Liu,CY
    [化學工程與材料工程學系 ] 期刊論文 2010 Electromigration-induced failures at Cu/Sn/Cu flip-chip joint interfaces Tseng,HW; Lu,CT; Hsiao,YH; Liao,PL; Chuang,YC; Chung,TY; Liu,CY
    [化學工程與材料工程學系 ] 期刊論文 2010 Growth Mechanism of a Ternary (Cu,Ni)(6)Sn(5) Compound at the Sn(Cu)/Ni(P) Interface Huang,TS; Tseng,HW; Lu,CT; Hsiao,YH; Chuang,YC; Liu,CY
    [化學工程與材料工程學系 ] 期刊論文 2010 Retardation of electromigration-induced Ni(P) consumption by an electroless Pd insertion layer Lu,CT; Tseng,HW; Chang,CH; Huang,TS; Liu,CY
    [化學工程與材料工程學系 ] 期刊論文 2010 Study of Interfacial Reactions Between Sn(Cu) Solders and Ni-Co Alloy Layers Huang,KC; Shieu,FS; Huang,TS; Lu,CT; Chen,CW; Tseng,HW; Cheng,SL; Liu,CY
    [化學工程與材料工程學系 ] 期刊論文 2010 Variation of Mechanical Property and Microstructure across Sn Solder Joint in Cu/Sn/Ni Structure Liu,CY; Tseng,HW; Song,JM
    [化學工程與材料工程研究所] 期刊論文 2009 Ag Electromigration Against Electron Flow in Sn5Ag/Cu Solder Bump Tseng,HW; Yeh,YT; Lin,KY; Liu,CY
    [化學工程與材料工程研究所] 期刊論文 2009 Cross-Interaction Between Au/Sn and Cu/Sn Interfacial Reactions Yen,YW; Tseng,HW; Zeng,K; Wang,SJ; Liu,CY
    [化學工程與材料工程研究所] 期刊論文 2009 Electromigration-Induced Failure of Ni/Cu Bilayer Bond Pads Joined with Sn(Cu) Solders Hsiao,YH; Tseng,HW; Liu,CY
    [化學工程與材料工程研究所] 期刊論文 2009 Surface oxidation of molten Sn(Ag, Ni, In, Cu) alloys Lee,YY; Tseng,HW; Hsiao,YH; Liu,CY
    [通訊工程學系] 期刊論文 2011 Rotational Listening Strategy for IEEE 802.15.4 Wireless Body Networks Tseng,HW; Sheu,ST; Shih,YY

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