中大機構典藏-NCU Institutional Repository-提供博碩士論文、考古題、期刊論文、研究計畫等下載:Items for Author

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Collection	Date	Title	Authors
[材料科學與工程研究所 ] 期刊論文	2005	In situ observation of the void formation-and-propagation mechanism in solder joints under current-stressing	Lin,YH; Hu,YC; Tsai,CM; Kao,CR; Tu,KN
[化學工程與材料工程研究所] 期刊論文	2005	Controlling the microstructures from the gold-tin reaction	Tsai,JY; Chang,CW; Shieh,YC; Hu,YC; Kao,CR
[化學工程與材料工程研究所] 期刊論文	2005	Electromigration induced metal dissolution in flip-chip solder joints	Lin,YH; Tsai,CM; Hu,YC; Lin,YL; Tsai,JY; Kao,CR
[化學工程與材料工程研究所] 期刊論文	2005	Electromigration-induced failure in flip-chip solder joints	Lin,YH; Tsai,CM; Hu,YC; Lin,YL; Kao,CR
[化學工程與材料工程研究所] 期刊論文	2003	A study on the reaction between cu and Sn3.5Ag solder doped with small amounts of Ni	Tsai,JY; Hu,YC; Tsai,CM; Kao,CR
[化學工程與材料工程研究所] 期刊論文	2003	Electromigration failure in flip chip solder joints due to rapid dissolution of copper	Hu,YC; Lin,YH; Kao,CR; Tu,KN
[生命科學研究所 ] 期刊論文	2005	Letter to the Editor: NMR structure note - Solution structure of a bacterial BolA-like protein XC975 from a plant pathogen Xanthomonas campestris pv. campestris	Chin,KH; Lin,FY; Hu,YC; Sze,KH; Lyu,PC; Chou,SH