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    顯示項目626-650 / 666. (共27頁)
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    日期題名作者
    2007 Coupling effect in Pt/Sn/Cu sandwich solder joint structures Wang,S. J.; Liu,C. Y.
    2007 Dimorphs of sucrose Lee,Tu; Lin,Yu Sheng
    2007 Effects of cross-channel extrusion on the micirostructures and superplasticity of a Zn-22 wt.% Al eutectoid alloy Chou,Cheng-Yu; Lee,Sheng-Long; Lin,Jing-Chie; Hsu,Ching-Miow
    2007 Effects of geometrical characteristics of surface roughness on droplet wetting Sheng,Yu-Jane; Jiang,Shaoyi; Tsao,Heng-Kwong
    2007 Electroless synthesis of pure nickel metal nanotubes using silicon oxide nanowires as removable templates Cheng,S. L.; Hsiao,W. C.
    2007 Fabrication of 2D ordered arrays of cobalt silicide nanodots on (0 0 1)Si substrates (vol 300, pg 473, 2007) Cheng,S. L.; Lu,S. W.; Wong,S. L.; Chang,C. C.; Chen,H.
    2007 Fabrication of 2D ordered arrays of cobalt silicide nanodots on (001)Si substrates Cheng,S. L.; Lu,S. W.; Wong,S. L.; Chang,C. C.; Chen,H.
    2007 Fabrication of a nanoscale single-crystalline silicon thin film on insulator Lee,T.-H.; Huang,C.-H.; Yang,Y.-Y.; Li,P.-W.; Suryasindhu,T.; Lee,S.
    2007 Fabrication of Mg-based intermetallic compounds by liquid electromigration Li,C. H.; Chuang,Y. C.; Liu,C. Y.
    2007 From superhydrophobic to superhydrophilic surfaces tuned by surfactant solutions Chang,Feng-Ming; Sheng,Yu-Jane; Chen,Hui; Tsao,Heng-Kwong
    2007 High thermally stable Ni/Ag(Al) alloy contacts on p-GaN Chou,C. H.; Lin,C. L.; Chuang,Y. C.; Bor,H. Y.; Liu,C. Y.
    2007 Light emission of sputtered particles induced by ion bombardment on water-enriched molecular ices Lee,Chin Shuang; Ip,Wing; Liu,S. H.; Hsu,G. Y.; Lee,Shyong
    2007 Light enhancement by the formation of an Al oxide honeycomb nanostructure on the n-GaN surface of thin-GaN light-emitting diodes Lin,C. L.; Chen,P. H.; Chan,Chia-Hua; Lee,C. C.; Chen,Chii-Chang; Chang,Jeng-Yang; Liu,C. Y.
    2007 Mass production of Mg2Ni alloy bulk by isothermal evaporation casting process Hsu,Che-Wei; Lee,Sheng-Long; Jeng,Rong-Ruey; Lin,Jing-Chie
    2007 Sublimation point depression of tris(8-hydroxyquinoline)aluminum(III) (Alq3) by crystal engineering Lee,Tu; Lin,Ming Shiou
    2007 The effect of thermomigration on phase coarsening in a eutectic SnPb alloy Chuang,Y. C.; Liu,C. Y.
    2006 Asymmetrical solder microstructure in Ni/Sn/Cu solder joint Wang,S. J.; Liu,C. Y.
    2006 Creep properties of Sn-3.5Ag-0.5Cu lead-free solder under step-loading Lin,Chih-Kuang; Teng,Hsuan-Yu
    2006 Cross-interaction between Au and Cu in Au/Sn/Cu ternary diffusion couples Chang CW,Lee QP,Ho CE,Kao CR
    2006 Current density dependence of electromigration-induced flip-chip Cu pad consumption Lin,C. T.; Chuang,Y. C.; Wang,S. J.; Liu,C. Y.
    2006 Effect of Fe and Si on properties of squeezed aluminium metal matrix Nd-Fe-B composite magnets Chuang,S. -F.; Lee,S. -L.; Lin,F. -J.; Lin,J. -C.
    2006 Effect of heat treatments on the tensile strength and SCC-resistance of AA7050 in an alkaline saline solution Lin,Jing-Chie; Liao,Hsueh-Lung; Jehng,Wern-Dare; Chang,Chih-Horng; Lee,Sheng-Long
    2006 Effects of limited Cu supply on soldering reactions between SnAgCu and Ni Ho CE,Lin YW,Yang SC,Kao CR,Jiang DS
    2006 Effects of strain ratio and tensile hold time on low-cycle fatigue of lead-free Sn-3.5Ag-0.5Cu solder Lin CK,Huang CM
    2006 Electromigration-induced UBM consumption and the resulting failure mechanisms in flip-chip solder joints Lin YL,Chang CW,Tsai CM,Lee CW,Kao CR

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