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	Electronic Thesis & Dissertation [372/372]
	journal & Dissertation [118/118]
	Research Project [176/176]

Siblings

	Graduate Institute of opto-Mechatronics [514/514]
	Department of Chemical and Materials Engineering [978/978]
	National Central University Department of Chemical & Materials Engineering [2693/2693]
	International Environment Sustainable Development Program [96/96]
	Department of Civil Engineering [1147/1147]
	Graduate Institute of Civil Engineering [3335/3335]
	Interdisciplinary Program, College of Engineering [9/9]
	International Master Degree Program in Applied Materials Science(IAMS) [9/9]
	Departmant of Mechanical Engineering [1791/1791]
	Graduate Institute of Mechanical Engineering [4191/4191]
	Graduate Institute of construction engineering [542/542]
	Graduate Institute of Environmental Engineering [1664/1664]
	Energy of Mechatronics [470/470]
	Executive Master of Civil Engineering [633/633]
	Executive Master of Mechanical Engineering [336/336]
	Executive Master of Construction Engineering and Management [174/174]
	Executive Master of Environmental Engineering [349/349]

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Date	Title	Authors
2007	Coupling effect in Pt/Sn/Cu sandwich solder joint structures	Wang,S. J.; Liu,C. Y.
2007	Dimorphs of sucrose	Lee,Tu; Lin,Yu Sheng
2007	Effects of cross-channel extrusion on the micirostructures and superplasticity of a Zn-22 wt.% Al eutectoid alloy	Chou,Cheng-Yu; Lee,Sheng-Long; Lin,Jing-Chie; Hsu,Ching-Miow
2007	Effects of geometrical characteristics of surface roughness on droplet wetting	Sheng,Yu-Jane; Jiang,Shaoyi; Tsao,Heng-Kwong
2007	Electroless synthesis of pure nickel metal nanotubes using silicon oxide nanowires as removable templates	Cheng,S. L.; Hsiao,W. C.
2007	Fabrication of 2D ordered arrays of cobalt silicide nanodots on (0 0 1)Si substrates (vol 300, pg 473, 2007)	Cheng,S. L.; Lu,S. W.; Wong,S. L.; Chang,C. C.; Chen,H.
2007	Fabrication of 2D ordered arrays of cobalt silicide nanodots on (001)Si substrates	Cheng,S. L.; Lu,S. W.; Wong,S. L.; Chang,C. C.; Chen,H.
2007	Fabrication of a nanoscale single-crystalline silicon thin film on insulator	Lee,T.-H.; Huang,C.-H.; Yang,Y.-Y.; Li,P.-W.; Suryasindhu,T.; Lee,S.
2007	Fabrication of Mg-based intermetallic compounds by liquid electromigration	Li,C. H.; Chuang,Y. C.; Liu,C. Y.
2007	From superhydrophobic to superhydrophilic surfaces tuned by surfactant solutions	Chang,Feng-Ming; Sheng,Yu-Jane; Chen,Hui; Tsao,Heng-Kwong
2007	High thermally stable Ni/Ag(Al) alloy contacts on p-GaN	Chou,C. H.; Lin,C. L.; Chuang,Y. C.; Bor,H. Y.; Liu,C. Y.
2007	Light emission of sputtered particles induced by ion bombardment on water-enriched molecular ices	Lee,Chin Shuang; Ip,Wing; Liu,S. H.; Hsu,G. Y.; Lee,Shyong
2007	Light enhancement by the formation of an Al oxide honeycomb nanostructure on the n-GaN surface of thin-GaN light-emitting diodes	Lin,C. L.; Chen,P. H.; Chan,Chia-Hua; Lee,C. C.; Chen,Chii-Chang; Chang,Jeng-Yang; Liu,C. Y.
2007	Mass production of Mg2Ni alloy bulk by isothermal evaporation casting process	Hsu,Che-Wei; Lee,Sheng-Long; Jeng,Rong-Ruey; Lin,Jing-Chie
2007	Sublimation point depression of tris(8-hydroxyquinoline)aluminum(III) (Alq3) by crystal engineering	Lee,Tu; Lin,Ming Shiou
2007	The effect of thermomigration on phase coarsening in a eutectic SnPb alloy	Chuang,Y. C.; Liu,C. Y.
2006	Asymmetrical solder microstructure in Ni/Sn/Cu solder joint	Wang,S. J.; Liu,C. Y.
2006	Creep properties of Sn-3.5Ag-0.5Cu lead-free solder under step-loading	Lin,Chih-Kuang; Teng,Hsuan-Yu
2006	Cross-interaction between Au and Cu in Au/Sn/Cu ternary diffusion couples	Chang CW,Lee QP,Ho CE,Kao CR
2006	Current density dependence of electromigration-induced flip-chip Cu pad consumption	Lin,C. T.; Chuang,Y. C.; Wang,S. J.; Liu,C. Y.
2006	Effect of Fe and Si on properties of squeezed aluminium metal matrix Nd-Fe-B composite magnets	Chuang,S. -F.; Lee,S. -L.; Lin,F. -J.; Lin,J. -C.
2006	Effect of heat treatments on the tensile strength and SCC-resistance of AA7050 in an alkaline saline solution	Lin,Jing-Chie; Liao,Hsueh-Lung; Jehng,Wern-Dare; Chang,Chih-Horng; Lee,Sheng-Long
2006	Effects of limited Cu supply on soldering reactions between SnAgCu and Ni	Ho CE,Lin YW,Yang SC,Kao CR,Jiang DS
2006	Effects of strain ratio and tensile hold time on low-cycle fatigue of lead-free Sn-3.5Ag-0.5Cu solder	Lin CK,Huang CM
2006	Electromigration-induced UBM consumption and the resulting failure mechanisms in flip-chip solder joints	Lin YL,Chang CW,Tsai CM,Lee CW,Kao CR