中大機構典藏-NCU Institutional Repository-提供博碩士論文、考古題、期刊論文、研究計畫等下載:
English  |  正體中文  |  简体中文  |  全文笔数/总笔数 : 80990/80990 (100%)
造访人次 : 41663830      在线人数 : 1724
RC Version 7.0 © Powered By DSPACE, MIT. Enhanced by NTU Library IR team.
搜寻范围 查询小技巧：
  • 您可在西文检索词汇前后加上"双引号"，以获取较精准的检索结果
  • 若欲以作者姓名搜寻，建议至进阶搜寻限定作者字段，可获得较完整数据
    •  进阶搜寻

    子类别

    博碩士論文 [372/372]
    期刊論文 [118/118]
    研究計畫 [176/176]

    邻近社群


    光機電工程研究所 [514/514]
    化學工程與材料工程學系 [978/978]
    化學工程與材料工程研究所 [2693/2693]
    國際永續發展在職專班 [96/96]
    土木工程學系 [1147/1147]
    土木工程研究所 [3335/3335]
    工學院學士班 [9/9]
    應用材料科學國際研究生碩士學位學程 [9/9]
    機械工程學系 [1791/1791]
    機械工程研究所 [4191/4191]
    營建管理研究所 [542/542]
    環境工程研究所 [1664/1664]
    能源工程研究所 [470/470]
    土木工程學系碩士在職專班 [633/633]
    機械工程學系碩士在職專班 [336/336]
    營建管理研究所碩士在職專班 [174/174]
    環境工程研究所碩士在職專班 [349/349]

    社群统计


    近3年内发表的文件: 106(15.92%)
    含全文笔数: 666(100.00%)

    文件下载次数统计
    下载大于0次: 666(100.00%)
    下载大于100次: 549(82.43%)
    全文下载总次数: 312438(0.77%)

    最后更新时间: 2024-11-21 23:47

    上传排行

    数据加载中.....

    下载排行

    数据加载中.....

    RSS Feed RSS Feed
    跳至:
    或输入年份:
    由新到旧排序 由最旧的开始

    显示项目626-650 / 666. (共27页)
    << < 18 19 20 21 22 23 24 25 26 27 > >>
    每页显示[10|25|50]项目

    日期题名作者
    2007 Coupling effect in Pt/Sn/Cu sandwich solder joint structures Wang,S. J.; Liu,C. Y.
    2007 Dimorphs of sucrose Lee,Tu; Lin,Yu Sheng
    2007 Effects of cross-channel extrusion on the micirostructures and superplasticity of a Zn-22 wt.% Al eutectoid alloy Chou,Cheng-Yu; Lee,Sheng-Long; Lin,Jing-Chie; Hsu,Ching-Miow
    2007 Effects of geometrical characteristics of surface roughness on droplet wetting Sheng,Yu-Jane; Jiang,Shaoyi; Tsao,Heng-Kwong
    2007 Electroless synthesis of pure nickel metal nanotubes using silicon oxide nanowires as removable templates Cheng,S. L.; Hsiao,W. C.
    2007 Fabrication of 2D ordered arrays of cobalt silicide nanodots on (0 0 1)Si substrates (vol 300, pg 473, 2007) Cheng,S. L.; Lu,S. W.; Wong,S. L.; Chang,C. C.; Chen,H.
    2007 Fabrication of 2D ordered arrays of cobalt silicide nanodots on (001)Si substrates Cheng,S. L.; Lu,S. W.; Wong,S. L.; Chang,C. C.; Chen,H.
    2007 Fabrication of a nanoscale single-crystalline silicon thin film on insulator Lee,T.-H.; Huang,C.-H.; Yang,Y.-Y.; Li,P.-W.; Suryasindhu,T.; Lee,S.
    2007 Fabrication of Mg-based intermetallic compounds by liquid electromigration Li,C. H.; Chuang,Y. C.; Liu,C. Y.
    2007 From superhydrophobic to superhydrophilic surfaces tuned by surfactant solutions Chang,Feng-Ming; Sheng,Yu-Jane; Chen,Hui; Tsao,Heng-Kwong
    2007 High thermally stable Ni/Ag(Al) alloy contacts on p-GaN Chou,C. H.; Lin,C. L.; Chuang,Y. C.; Bor,H. Y.; Liu,C. Y.
    2007 Light emission of sputtered particles induced by ion bombardment on water-enriched molecular ices Lee,Chin Shuang; Ip,Wing; Liu,S. H.; Hsu,G. Y.; Lee,Shyong
    2007 Light enhancement by the formation of an Al oxide honeycomb nanostructure on the n-GaN surface of thin-GaN light-emitting diodes Lin,C. L.; Chen,P. H.; Chan,Chia-Hua; Lee,C. C.; Chen,Chii-Chang; Chang,Jeng-Yang; Liu,C. Y.
    2007 Mass production of Mg2Ni alloy bulk by isothermal evaporation casting process Hsu,Che-Wei; Lee,Sheng-Long; Jeng,Rong-Ruey; Lin,Jing-Chie
    2007 Sublimation point depression of tris(8-hydroxyquinoline)aluminum(III) (Alq3) by crystal engineering Lee,Tu; Lin,Ming Shiou
    2007 The effect of thermomigration on phase coarsening in a eutectic SnPb alloy Chuang,Y. C.; Liu,C. Y.
    2006 Asymmetrical solder microstructure in Ni/Sn/Cu solder joint Wang,S. J.; Liu,C. Y.
    2006 Creep properties of Sn-3.5Ag-0.5Cu lead-free solder under step-loading Lin,Chih-Kuang; Teng,Hsuan-Yu
    2006 Cross-interaction between Au and Cu in Au/Sn/Cu ternary diffusion couples Chang CW,Lee QP,Ho CE,Kao CR
    2006 Current density dependence of electromigration-induced flip-chip Cu pad consumption Lin,C. T.; Chuang,Y. C.; Wang,S. J.; Liu,C. Y.
    2006 Effect of Fe and Si on properties of squeezed aluminium metal matrix Nd-Fe-B composite magnets Chuang,S. -F.; Lee,S. -L.; Lin,F. -J.; Lin,J. -C.
    2006 Effect of heat treatments on the tensile strength and SCC-resistance of AA7050 in an alkaline saline solution Lin,Jing-Chie; Liao,Hsueh-Lung; Jehng,Wern-Dare; Chang,Chih-Horng; Lee,Sheng-Long
    2006 Effects of limited Cu supply on soldering reactions between SnAgCu and Ni Ho CE,Lin YW,Yang SC,Kao CR,Jiang DS
    2006 Effects of strain ratio and tensile hold time on low-cycle fatigue of lead-free Sn-3.5Ag-0.5Cu solder Lin CK,Huang CM
    2006 Electromigration-induced UBM consumption and the resulting failure mechanisms in flip-chip solder joints Lin YL,Chang CW,Tsai CM,Lee CW,Kao CR

    显示项目626-650 / 666. (共27页)
    << < 18 19 20 21 22 23 24 25 26 27 > >>
    每页显示[10|25|50]项目

    ::: Copyright National Central University. | 國立中央大學圖書館版權所有 | 收藏本站 | 設為首頁 | 最佳瀏覽畫面: 1024*768 | 建站日期：8-24-2009 :::
    DSpace Software Copyright © 2002-2004  MIT &  Hewlett-Packard  /   Enhanced by   NTU Library IR team Copyright ©   - 隱私權政策聲明