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    "Lin,YL"的相关文件  

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    显示 19 项.

    类别 日期 题名 作者 档案
    [經濟學系] 期刊論文 2011 THE EFFECTS OF EMPLOYMENT PROTECTION ON LABOR TURNOVER: EMPIRICAL EVIDENCE FROM TAIWAN Kan,KH; Lin,YL
    [大氣物理研究所 ] 期刊論文 2011 Orographic effects on localized heavy rainfall events over southwestern Taiwan on 27 and 28 June 2008 during the post-Mei-Yu period Chen,CS; Lin,YL; Hsu,NN; Liu,CL; Chen,CY
    [大氣物理研究所 ] 期刊論文 2010 Investigation of a heavy rainfall event over southwestern Taiwan associated with a subsynoptic cyclone during the 2003 Mei-Yu season Chen,CS; Lin,YL; Peng,WC; Liu,CL
    [學習與教學研究所 ] 期刊論文 2010 Development and Evaluation of an Interactive Mobile Learning Environment with Shared Display Groupware Yang,JC; Lin,YL
    [化學工程與材料工程學系 ] 期刊論文 2011 Self-Assembled Superstructures of Polymer-Grafted Nanoparticles: Effects of Particle Shape and Matrix Polymer Lin,YL; Chiou,CS; Kumar,SK; Lin,JJ; Sheng,YJ; Tsao,HK
    [大氣物理研究所 ] 期刊論文 2000 An intercomparison of model-predicted wave breaking for the 11 January 1972 Boulder windstorm Doyle,JD; Durran,DR; Chen,C; Colle,BA; Georgelin,M; Grubisic,V; Hsu,WR; Huang,CY; Landau,D; Lin,YL; Poulos,GS; Sun,WY; Weber,DB; Wurtele,MG; Xue,M
    [大氣物理研究所 ] 期刊論文 2002 Orographic influences on rainfall and track deflection associated with the passage of a tropical cyclone Lin,YL; Ensley,DB; Chiao,S; Huang,CY
    [大氣物理研究所 ] 期刊論文 2005 Control parameters for the influence of a mesoscale mountain range on cyclone track continuity and deflection Lin,YL; Chen,SY; Hill,CM; Huang,CY
    [化學工程與材料工程研究所] 期刊論文 2002 Strong effect of Cu concentration on the reaction between lead-free microelectronic solders and Ni Ho,CE; Lin,YL; Kao,CR
    [化學工程與材料工程研究所] 期刊論文 2002 Effect of Cu concentration on the reactions between Sn-Ag-Cu solders and Ni Ho,CE; Tsai,RY; Lin,YL; Kao,CR
    [化學工程與材料工程研究所] 期刊論文 2003 Chemical reaction in solder joints of microelectronic packages Ho,CE; Lin,YL; Tsai,JY; Kao,CR
    [化學工程與材料工程研究所] 期刊論文 2004 Effects of the gold thickness of the surface finish on the interfacial reactions in flip-chip solder joints Lin,YL; Luo,WC; Lin,YH; Ho,CE; Kao,CR
    [化學工程與材料工程研究所] 期刊論文 2005 Electromigration-induced failure in flip-chip solder joints Lin,YH; Tsai,CM; Hu,YC; Lin,YL; Kao,CR
    [化學工程與材料工程研究所] 期刊論文 2005 Electromigration induced metal dissolution in flip-chip solder joints Lin,YH; Tsai,CM; Hu,YC; Lin,YL; Tsai,JY; Kao,CR
    [材料科學與工程研究所 ] 期刊論文 2005 Solid-state reactions between Ni and Sn-Ag-Cu solders with different Cu concentrations Luo,WC; Ho,CE; Tsai,JY; Lin,YL; Kao,CR
    [大氣物理研究所 ] 期刊論文 1999 Orographic influence on a drifting cyclone Lin,YL; Han,JG; Hamilton,DW; Huang,CY
    [機械工程研究所] 期刊論文 1995 EFFECTS OF BE AND FE CONTENT ON PLANE-STRAIN FRACTURE-TOUGHNESS IN A357 ALLOYS TAN,YH; LEE,SL; LIN,YL
    [機械工程研究所] 期刊論文 1995 EFFECTS OF BE AND FE ADDITIONS ON THE MICROSTRUCTURE AND MECHANICAL-PROPERTIES OF A357.0 ALLOYS TAN,YH; LEE,SL; LIN,YL
    [化學工程與材料工程研究所] 期刊論文 1997 High-resolution images of ultrafine LiCoO2 powders synthesized by a sol-gel process Fey,GTK; Chen,KS; Hwang,BJ; Lin,YL

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