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    Items for Author "Liu,C. Y." 

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    Showing 15 items.

    Collection Date Title Authors Bitstream
    [材料科學與工程研究所 ] 期刊論文 2006 Asymmetrical solder microstructure in Ni/Sn/Cu solder joint Wang,S. J.; Liu,C. Y.
    [材料科學與工程研究所 ] 期刊論文 2006 Current density dependence of electromigration-induced flip-chip Cu pad consumption Lin,C. T.; Chuang,Y. C.; Wang,S. J.; Liu,C. Y.
    [材料科學與工程研究所 ] 期刊論文 2006 Study of electromigration-induced Cu consumption in the flip-chip Sn/Cu solder bumps Liu,C. Y.; Ke,Lin; Chuang,Y. C.; Wang,S. J.
    [化學工程與材料工程研究所] 期刊論文 2006 Kinetic analysis of the interfacial reactions in Ni/Sn/Cu sandwich structures Wang,S. J.; Liu,C. Y.
    [光電科學研究中心] 期刊論文 2006 Fabrication and tolerance reduction of a Si-based pickup module for optical storage Lee,Chien-Chieh; Wang,Chih-Ming; Huang,S. K.; Chang,J. Y.; Chi,Gou-Chung; Hsu,S. C.; Liu,C. Y.
    [材料科學與工程研究所 ] 期刊論文 2007 Ag/Au diffusion wafer bonding for thin-GaN LED fabrication Chang,C. L.; Chuang,Y. C.; Liu,C. Y.
    [材料科學與工程研究所 ] 期刊論文 2007 Amorphous Si/Au wafer bonding Chen,P. H.; Lin,C. L.; Liu,C. Y.
    [材料科學與工程研究所 ] 期刊論文 2007 Coupling effect in Pt/Sn/Cu sandwich solder joint structures Wang,S. J.; Liu,C. Y.
    [材料科學與工程研究所 ] 期刊論文 2007 Fabrication of Mg-based intermetallic compounds by liquid electromigration Li,C. H.; Chuang,Y. C.; Liu,C. Y.
    [材料科學與工程研究所 ] 期刊論文 2007 High thermally stable Ni/Ag(Al) alloy contacts on p-GaN Chou,C. H.; Lin,C. L.; Chuang,Y. C.; Bor,H. Y.; Liu,C. Y.
    [材料科學與工程研究所 ] 期刊論文 2007 Light enhancement by the formation of an Al oxide honeycomb nanostructure on the n-GaN surface of thin-GaN light-emitting diodes Lin,C. L.; Chen,P. H.; Chan,Chia-Hua; Lee,C. C.; Chen,Chii-Chang; Chang,Jeng-Yang; Liu,C. Y.
    [材料科學與工程研究所 ] 期刊論文 2007 The effect of thermomigration on phase coarsening in a eutectic SnPb alloy Chuang,Y. C.; Liu,C. Y.
    [化學工程與材料工程研究所] 期刊論文 2007 Stress relaxation in GaN by transfer bonding on Si substrates Hsu,S. C.; Pong,B. J.; Li,W. H.; Beechem,Thomas E.,III; Graham,Samuel; Liu,C. Y.
    [材料科學與工程研究所 ] 期刊論文 2008 Evolution of Ag3Sn compound formation in Ni/Sn5Ag/Cu solder joint Tseng,H. W.; Liu,C. Y.
    [化學工程與材料工程研究所] 期刊論文 2008 Electromigration studies of Cu/carbon nanotube composite interconnects using Blech structure Chai,Yang; Chan,Philip C. H.; Fu,Yunyi; Chuang,Y. C.; Liu,C. Y.

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