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类别	日期	题名	作者
[化學工程與材料工程研究所] 期刊論文	2005	Electromigration induced metal dissolution in flip-chip solder joints	Lin,YH; Tsai,CM; Hu,YC; Lin,YL; Tsai,JY; Kao,CR
[化學工程與材料工程研究所] 期刊論文	2005	Electromigration-induced failure in flip-chip solder joints	Lin,YH; Tsai,CM; Hu,YC; Lin,YL; Kao,CR
[化學工程與材料工程研究所] 期刊論文	2004	Cross-interaction of under-bump metallurgy and surface finish in flip-chip solder joints	Tsai,CM; Luo,WC; Chang,CW; Shieh,YC; Kao,CR
[化學工程與材料工程研究所] 期刊論文	2003	A study on the reaction between cu and Sn3.5Ag solder doped with small amounts of Ni	Tsai,JY; Hu,YC; Tsai,CM; Kao,CR
[材料科學與工程研究所 ] 期刊論文	2005	In situ observation of the void formation-and-propagation mechanism in solder joints under current-stressing	Lin,YH; Hu,YC; Tsai,CM; Kao,CR; Tu,KN
[網路學習科技研究所 ] 期刊論文	2005	Assessment based on linkage patterns in concept maps	Liu,CC; Don,PH; Tsai,CM
[網路學習科技研究所 ] 期刊論文	2005	Peer assessment through web-based knowledge acquisition: tools to support conceptual awareness	Liu,CC; Tsai,CM